公开(公告)号：US10400961B2

公开(公告)日：2019-09-03

申请号：US15485600

申请日：2017-04-12

Applicant: GE Lighting Solutions, LLC

Inventor： Xin Wang ,  Brian Morgan Spahnie ,  Suping Wang ,  Yan Ni

IPC: F21K9/69 ,  F21V29/70 ,  F21V29/89 ,  F21K9/66 ,  F21K9/275 ,  F21V19/00 ,  F21V3/02 ,  F21V5/04 ,  F21S4/28 ,  F21Y103/10 ,  F21Y115/10 ,  F21Y107/90

Abstract: A lighting device includes an elongated support member, first and second printed circuit boards, at least one first LED, at least one second LED and at least one lens element. The elongated support member includes first and second sides, the first and second PCBs coupled to the first and second sides of the elongated support member, respectively, the at least one first LED mounted on the first PCB and the at least one second LED mounted on the second PCB, each lens element includes at least one lens, the lens element mounted on the PCB at a location such that each lens substantially surrounds a respective one of the LEDs.

公开(公告)号：US20180156426A1

公开(公告)日：2018-06-07

申请号：US15724896

申请日：2017-10-04

Applicant: GE Lighting Solutions, LLC

Inventor： Yongli Feng ,  Yong fen Chen ,  Brian Morgan Spahnie ,  Yan Ni

IPC: F21V19/00 ,  F21V23/00 ,  F21S4/28 ,  F21K9/90

CPC classification number: F21V19/005 ,  F21K9/90 ,  F21S4/28 ,  F21V23/002 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H05K3/0058 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10106 ,  Y02P70/613

Abstract: An LED module having improved bonding features is described. In some embodiments, an LED module includes at least one LED light source, at least one wire, and a housing that has a rear wall having a surface. A flow channel is cut into at least one portion of the surface of the rear wall, which provides additional surface area when glue is applied to affix the housing of the LED module to a substrate.