SILICON-BASED REPAIR METHODS AND COMPOSITION
    1.
    发明申请
    SILICON-BASED REPAIR METHODS AND COMPOSITION 有权
    基于硅的维修方法和组合

    公开(公告)号:US20160194476A1

    公开(公告)日:2016-07-07

    申请号:US14589021

    申请日:2015-01-05

    Abstract: There is set forth herein a silicon-based patch formulation comprising about 25 to 66 percent by volume of a solvent; about 4 to 10 percent by volume of a silicon-comprising binding material; and about 30 to 65 percent by volume of a patching material, the patching material comprising particles having one or more non-actinide Group IIIA elements, wherein a molar ratio of the one or more non-actinide Group IIIA elements to silicon within the patch formulation is about 0.95 to 1.25.

    Abstract translation: 本文提出了含有约25至66%(体积)溶剂的硅基贴片制剂; 约4至10体积%的含硅粘合材料; 和约30至65体积%的修补材料,所述修补材料包含具有一种或多种非锕系IIIA族元素的颗粒,其中所述一种或多种非锕系IIIA族元素与所述贴剂配方中的硅的摩尔比 为约0.95至1.25。

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