Abstract:
A method for removing a material from a surface of a substrate includes impinging a laser beam on the material during a first sweep to remove the material from the surface along a first line and impinging the laser beam on the material during a second sweep to remove the material from the surface along a second line adjacent to the first line. The first line includes first artifacts that form a first portion of an array of artifacts on the surface. The second line includes second artifacts that form a second portion of the array of artifacts on the surface. A first laser pulse of the laser beam corresponding with the second sweep is synchronized with a start of the second sweep when transitioning between the first line and the second line such that the start of the second sweep coincides with the first laser pulse.
Abstract:
A method for removing a material from a surface of a substrate includes impinging a laser beam on the material during a first sweep to remove the material from the surface along a first line and impinging the laser beam on the material during a second sweep to remove the material from the surface along a second line adjacent to the first line. The first line includes first artifacts that form a first portion of an array of artifacts on the surface. The second line includes second artifacts that form a second portion of the array of artifacts on the surface. A first laser pulse of the laser beam corresponding with the second sweep is synchronized with a start of the second sweep when transitioning between the first line and the second line such that the start of the second sweep coincides with the first laser pulse.
Abstract:
A method for removing a material from a surface includes passing a laser through a lens such that the laser impinges on the material. The surface from which the material is removed has an array of artifacts thereon with a spacing between the artifacts and a pitch between lines of the artifacts. At least the spacing between the artifacts is varied.
Abstract:
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and edge extending around at least a portion of a perimeter of the substantially transparent substrate, wherein the edge being a laser induced channel edge having enhanced edge characteristics.
Abstract:
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and an edge extending around at least a portion of a perimeter of the substantially transparent substrate, wherein the edge is a laser induced channel edge having enhanced edge characteristics.
Abstract:
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and an edge extending around at least a portion of a perimeter of the substantially transparent substrate, wherein the edge is a laser induced channel edge having enhanced edge characteristics.
Abstract:
A method for removing a material from a surface includes passing a laser through a lens such that the laser impinges on the material. The surface from which the material is removed has an array of artifacts thereon with a spacing between the artifacts and a pitch between lines of the artifacts. At least the spacing between the artifacts is varied.
Abstract:
An apparatus, method, and process that includes a substantially transparent substrate having a first surface, a second surface, and edge extending around at least a portion of a perimeter of the substantially transparent substrate, wherein the edge being a laser induced channel edge having enhanced edge characteristics.
Abstract:
A method is provided for laser ablation that reduces or eliminates a diffraction effect produced by damage to a surface from which an ablated material is removed. The method includes at least one of reducing the amount of surface damage produced and altering the damage structure produced such that it is irregular.
Abstract:
A method is provided for laser ablation that reduces or eliminates a diffraction effect produced by damage to a surface from which an ablated material is removed. The method includes at least one of reducing the amount of surface damage produced and altering the damage structure produced such that it is irregular.