公开(公告)号：US09666674B2

公开(公告)日：2017-05-30

申请号：US14691270

申请日：2015-04-20

Applicant: GLOBALFOUNDRIES INC.

Inventor： Christos D. Dimitrakopoulos ,  Keith E. Fogel ,  Jeehwan Kim ,  Hongsik Park

IPC: H01L29/06 ,  H01L29/16 ,  H01L21/027 ,  H01L21/20 ,  B32B9/04 ,  B32B37/26 ,  B32B38/10 ,  C01B31/00 ,  C01B31/04 ,  B32B9/00 ,  H01L23/532

CPC classification number: H01L29/1606 ,  B32B9/007 ,  B32B9/041 ,  B32B38/10 ,  B32B2307/202 ,  B32B2307/704 ,  C01B32/188 ,  H01L21/0272 ,  H01L21/2007 ,  H01L23/53276 ,  H01L2924/0002 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T428/24612 ,  Y10T428/26 ,  H01L2924/00

Abstract: A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.

公开(公告)号：US09337274B2

公开(公告)日：2016-05-10

申请号：US13894954

申请日：2013-05-15

Applicant: GLOBALFOUNDRIES INC.

Inventor： Christos D. Dimitrakopoulos ,  Keith E. Fogel ,  Jeehwan Kim ,  Hongsik Park

IPC: H01L29/06 ,  H01L21/027 ,  H01L21/20 ,  B32B37/14 ,  C01B31/00 ,  B32B38/10 ,  B32B9/04 ,  H01L29/16 ,  B32B37/26 ,  C01B31/04 ,  B32B9/00 ,  H01L23/532

CPC classification number: H01L29/1606 ,  B32B9/007 ,  B32B9/041 ,  B32B38/10 ,  B32B2307/202 ,  B32B2307/704 ,  C01B32/188 ,  H01L21/0272 ,  H01L21/2007 ,  H01L23/53276 ,  H01L2924/0002 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T428/24612 ,  Y10T428/26 ,  H01L2924/00

Abstract: A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.