公开(公告)号：US20240324118A1

公开(公告)日：2024-09-26

申请号：US18026816

申请日：2022-05-11

申请人： MIANYANG BOE OPTOELECTRONICS TECHNOLOGY CO.,Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Yongkai WU ,  Tingyuan WANG ,  Chao QI ,  Zhengping XIONG ,  Qi LIU ,  Yunzhi WANG

IPC分类号： H05K5/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/18 ,  B32B7/022 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B15/04 ,  B32B15/18 ,  B32B27/28 ,  B32B27/36

CPC分类号： H05K5/02 ,  B32B3/266 ,  B32B3/30 ,  B32B5/18 ,  B32B7/022 ,  B32B7/12 ,  B32B9/007 ,  B32B9/045 ,  B32B9/046 ,  B32B15/046 ,  B32B15/18 ,  B32B27/281 ,  B32B27/36 ,  B32B2255/10 ,  B32B2307/4023 ,  B32B2307/42 ,  B32B2307/536 ,  B32B2307/546 ,  B32B2307/7376 ,  B32B2457/20

摘要： A flexible display module includes a flexible display substrate, a cover layer provided on a display side of the flexible display substrate, and a support layer on a side of the flexible display substrate facing away from the display side; the cover layer includes a first flexible film material and a first graphene layer on a surface of the first flexible film material facing away from the flexible display substrate; the support layer includes a rigid material layer and a first flexible material layer, the rigid material layer includes a hollowed region and non-hollowed regions located on two sides of the hollowed region, a width of the hollowed region is larger than a width of the bending region of the flexible display module, the first flexible material layer is provided on a surface of the rigid material layer facing the flexible display substrate and is filled in the hollowed region.

公开(公告)号：US12076973B2

公开(公告)日：2024-09-03

申请号：US18350284

申请日：2023-07-11

申请人： II-VI Delaware, Inc.

发明人： Wen-Qing Xu ,  Di Lan ,  Christopher Koeppen

IPC分类号： B32B9/00 ,  B32B37/18 ,  B32B38/00

CPC分类号： B32B9/007 ,  B32B37/18 ,  B32B38/0008 ,  B32B2038/0064 ,  B32B2310/14 ,  B32B2551/08

摘要： A wafer has a layer containing silicon, a layer of polycrystalline diamond deposited on the silicon-containing layer, and a bow-compensation layer on the other side of the silicon-containing layer for reducing wafer-bow. A method of making a bonded structure includes an activation process for creating dangling bonds on the surface of one substrate, followed by contact-bonding the surface to a second substrate at low temperature. A bonded structure may include two substrates contact bonded to each other, one substrate including a layer containing silicon, a layer of polycrystalline diamond, a bow-compensation layer for reducing wafer-bow of the first substrate, and the other substrate including gallium nitride, silicon carbide, lithium niobate, lithium tantalate, gallium arsenide, indium phosphide, or another suitable material other than diamond.

公开(公告)号：US20240166519A1

公开(公告)日：2024-05-23

申请号：US18513952

申请日：2023-11-20

申请人： Technology Innovation Institute - Sole Proprietorship LLC

发明人： Juveiriah M. Ashraf ,  Myriam Ghodhbane ,  Abdulrahman Alshaya ,  Sunil Lonkar ,  Zainab Karam ,  Chiara Busa ,  Vincenzo Giannini

IPC分类号： C01B32/174 ,  B32B9/00 ,  B32B9/04 ,  B32B37/18

CPC分类号： C01B32/174 ,  B32B9/007 ,  B32B9/04 ,  B32B37/18 ,  B32B2313/04 ,  C01P2004/24 ,  C01P2006/90

摘要： A method for producing carbon nanotube sheets is provided. The method may include steps of: dispersing carbon nanotubes and cellulose in a solvent to form a slurry, stirring the slurry, and depositing the slurry onto a substrate using a coating method to form a carbon nanotube sheet. The carbon nanotube sheet may include 0.1 wt. % to about 95 wt. % cellulose relative to the total weight of the carbon nanotube sheet and may have an emissivity of about 0.05 to about 0.3. The carbon nanotube sheet may be utilized to provide infrared shielding to a surface.

公开(公告)号：US20240165909A1

公开(公告)日：2024-05-23

申请号：US18352566

申请日：2023-07-14

申请人： Joby Aero, Inc.

发明人： Joseph Daniel Brennan ,  John Angely Geriguis ,  Nobuya Kawamura

IPC分类号： B32B3/18 ,  B32B7/022 ,  B32B9/00 ,  B32B9/04 ,  B32B27/18 ,  B32B27/28 ,  B64C1/00 ,  B64C3/18 ,  B64C3/26

CPC分类号： B32B3/18 ,  B32B7/022 ,  B32B9/007 ,  B32B9/045 ,  B32B27/18 ,  B32B27/28 ,  B32B2262/101 ,  B32B2307/54 ,  B32B2605/18 ,  B64C2001/0072 ,  B64C3/187 ,  B64C3/26

摘要： A laminate material for an aircraft component is provided. The laminate material includes a first layer, a second layer and a rib disposed between the first and second layer. One or more connectors are configured to couple the ends of the rib to the first layer and the second layer. The connectors comprise a thermoplastic resin. Aircraft components are also provided.

公开(公告)号：US11938715B2

公开(公告)日：2024-03-26

申请号：US16229668

申请日：2018-12-21

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Luigi Colombo ,  Nazila Dadvand ,  Benjamin Stassen Cook ,  Archana Venugopal

IPC分类号： B32B9/00 ,  B32B9/04 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00 ,  B82Y30/00

CPC分类号： B32B9/007 ,  B32B9/041 ,  B32B9/045 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00 ,  B32B2305/38 ,  B32B2457/14 ,  B82Y30/00 ,  C01P2002/20 ,  Y10T428/30

摘要： A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.

公开(公告)号：US11937364B2

公开(公告)日：2024-03-19

申请号：US17358122

申请日：2021-06-25

申请人： Seong Hwan Jung ,  SOLUETA

发明人： Seong Hwan Jung

IPC分类号： B32B7/12 ,  B32B9/00 ,  F21S41/32 ,  H05K1/02

CPC分类号： H05K1/0209 ,  B32B7/12 ,  B32B9/007 ,  F21S41/32 ,  H05K1/028 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/10106

摘要： A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

公开(公告)号：US11932542B2

公开(公告)日：2024-03-19

申请号：US17649092

申请日：2022-01-27

申请人： KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE

发明人： Prashant Narute ,  Seong-Gu Hong

IPC分类号： B29C59/18 ,  B29C61/02 ,  B29C65/00 ,  B32B3/28 ,  B32B9/00 ,  B32B9/04 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B38/00 ,  B82Y40/00 ,  C01B32/194 ,  C23C16/26 ,  H01B5/14 ,  B29C43/02 ,  H01B1/04

CPC分类号： C01B32/194 ,  B29C59/18 ,  B29C61/02 ,  B29C66/73715 ,  B32B3/28 ,  B32B9/007 ,  B32B9/045 ,  B32B27/281 ,  B32B27/283 ,  B32B27/306 ,  B32B27/36 ,  B32B38/004 ,  B82Y40/00 ,  C23C16/26 ,  B29C2043/025 ,  B32B2313/04 ,  H01B1/04 ,  H01B5/14

摘要： A large-area wrinkled graphene substrate capable of being manufactured in a large-area, and a method for manufacturing the same is provided. A method for manufacturing a wrinkled graphene substrate includes: i) providing a graphene unit; ii) inserting a carrier film and a graphene unit between a pair of rolls and rotating the pair of rolls in opposite directions to attach a carrier film on the graphene unit, iii) immersing the graphene unit in an etching solution to provide graphene, iv) between a pair of rolls, graphene and poly(4-styrene sulfonic acid)/polystyrene (PSS/PS) substrate attaching graphene onto the PSS/PS substrate, v) attaching an ethylene vinyl acetate/polyethylene terephthalate (EVA/PET) substrate to wrinkled graphene on PSS/PS substrate by inserting EVA/PET and WGr/PSS/PS stack between the rolls, viii) removing the PSS/PS substrate by immersing PET/EVA/WGr/PSS/PS stack in water, and ix) providing a wrinkled graphene substrate on the EVA/PET substrate.

公开(公告)号：US11932000B2

公开(公告)日：2024-03-19

申请号：US17209924

申请日：2021-03-23

申请人： WHIRLPOOL CORPORATION

发明人： Muhammad Khizar ,  Maria Paola Pirovano

IPC分类号： B32B7/022 ,  B32B1/00 ,  B32B5/02 ,  B32B9/00 ,  B32B23/08 ,  B32B27/08 ,  B32B27/30 ,  F25D23/06 ,  F25D25/02

CPC分类号： B32B7/022 ,  B32B1/00 ,  B32B5/024 ,  B32B9/007 ,  B32B23/08 ,  B32B27/08 ,  B32B27/306 ,  B32B27/308 ,  F25D23/066 ,  F25D25/025 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/42 ,  B32B2307/7244 ,  B32B2509/10 ,  F25D2201/00

摘要： A refrigerator is disclosed for improved food storage capability. The refrigerator comprises an internal cavity having a membrane that at least partially covers a portion of the walls of the internal cavity.

公开(公告)号：US11930956B2

公开(公告)日：2024-03-19

申请号：US16714120

申请日：2019-12-13

申请人： All-Clad Metalcrafters, L.L.C.

发明人： William A. Groll ,  Jean Murray Stewart

IPC分类号： A47J36/04 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20

CPC分类号： A47J36/04 ,  B32B9/007 ,  B32B15/20 ,  B32B9/041

摘要： Provided is cookware made from a bonded multi-layer blank assembly. The cookware has a first metal layer, a second metal layer having a cavity with a plurality of spaced-apart posts protruding from a bottom surface of the cavity, and a perforated graphite layer having a thickness of at least 0.010 in. (0.254 mm) and a plurality of spaced-apart holes formed therethrough. The perforated graphite layer is positioned within the cavity of the second metal layer such that the plurality of spaced-apart posts extend through the plurality of spaced-apart holes. The second metal layer is metallurgically bonded to the first metal layer at least via the plurality of spaced-apart posts. A method of making the bonded multi-layer composite cookware is also disclosed.

公开(公告)号：US20240066835A1

公开(公告)日：2024-02-29

申请号：US18269829

申请日：2021-12-24

申请人： LUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)

发明人： Antoine DUHAIN ,  Guillaume LAMBLIN ,  Damien LENOBLE ,  Marc MICHEL

IPC分类号： B32B9/04 ,  B32B5/02 ,  B32B9/00 ,  B32B15/02 ,  B32B15/04 ,  B32B15/14 ,  B32B15/20 ,  B64D45/02

CPC分类号： B32B9/041 ,  B32B5/02 ,  B32B9/007 ,  B32B15/02 ,  B32B15/043 ,  B32B15/14 ,  B32B15/20 ,  B64D45/02 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/7376 ,  B32B2605/18

摘要： A lightning strike protection material is proposed that includes a substrate, the substrate carrying a metal layer, and, on the metal layer, a copper-nanocarbon composite layer, the copper-nanocarbon composite layer having a nanocarbon tangle formed of carbon nanotubes and/or graphene sheets, the nanocarbon tangle embedded within a copper phase and distributed throughout the copper-nanocarbon composite layer.