公开(公告)号：US20240300214A1

公开(公告)日：2024-09-12

申请号：US18171610

申请日：2023-03-06

申请人： DeMarcus Oshay Carney

发明人： DeMarcus Oshay Carney

IPC分类号： B32B9/04 ,  B32B9/00

CPC分类号： B32B9/041 ,  B32B9/007 ,  B32B2250/40 ,  B32B2307/746

摘要： My invention is comprised of only three components: superfluid helium-4, graphene, and mercury telluride. When these three pieces are arranged in a tri-layer so that the mercury telluride encases the graphene, and superfluid helium-4, a frictionless environment is created within this structure. My invention could potentially replace the gold wrapped silicon ion traps in some of todays quantum computers, through an embodiment of my invention, or by simply wrapping my invention in gold. Electrical signals in my innovative tri-layer will be enabled in such a way that they can travel through this tri-layer instantly.

公开(公告)号：US12065385B2

公开(公告)日：2024-08-20

申请号：US17296172

申请日：2019-11-22

申请人： DENKA COMPANY LIMITED

发明人： Akimasa Yuasa ,  Takahiro Nakamura ,  Shuhei Morita ,  Koji Nishimura

IPC分类号： B32B7/12 ,  B32B9/04 ,  B32B15/20 ,  B32B18/00 ,  C04B37/02 ,  H05K1/03 ,  H05K1/09

CPC分类号： C04B37/026 ,  B32B7/12 ,  B32B9/041 ,  B32B15/20 ,  B32B18/00 ,  H05K1/0306 ,  H05K1/09 ,  B32B2250/40 ,  B32B2457/08 ,  C04B2237/125 ,  C04B2237/407 ,  C04B2237/60

摘要： A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer. When a region having a length of 1,700 μm in a long-side direction is a region P on a cut surface of the ceramic-copper composite obtained when the ceramic-copper composite is cut with a plane perpendicular to a main surface of the ceramic-copper composite, an average crystal grain size D1 of copper crystals at least partially present in a region P1 within 50 μm on a side of the copper layer from an interface between the ceramic layer and the brazing material layer in the region P is 30 μm or more and 100 μm or less.

公开(公告)号：US20240246317A1

公开(公告)日：2024-07-25

申请号：US18585500

申请日：2024-02-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Luigi COLOMBO ,  Nazila DADVAND ,  Benjamin Stassen COOK ,  Archana VENUGOPAL

IPC分类号： B32B9/00 ,  B32B9/04 ,  B82Y30/00 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00

CPC分类号： B32B9/007 ,  B32B9/041 ,  B32B9/045 ,  C01B32/184 ,  C01B32/19 ,  C23C18/32 ,  C23C18/38 ,  H01M50/00 ,  B32B2305/38 ,  B32B2457/14 ,  B82Y30/00 ,  C01P2002/20 ,  Y10T428/30

摘要： A microstructure comprises a plurality of interconnected units wherein the units are formed of graphene tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing graphitic carbon on the metal microlattice, converting the graphitic carbon to graphene, and removing the metal microlattice.

公开(公告)号：US20240149340A1

公开(公告)日：2024-05-09

申请号：US18279012

申请日：2022-03-28

申请人： Mitsui Mining & Smelting Co., Ltd.

发明人： Shinichi YAMAUCHI ,  Kei ANAI

IPC分类号： B22F7/06 ,  B22F1/052 ,  B22F1/054 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/04 ,  B32B15/20 ,  H01L23/00

CPC分类号： B22F7/064 ,  B22F1/052 ,  B22F1/056 ,  B22F1/068 ,  B22F1/107 ,  B22F3/14 ,  B22F7/08 ,  B32B7/12 ,  B32B9/041 ,  B32B15/20 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  B22F2201/02 ,  B22F2301/10 ,  B22F2304/056 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/748 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/29147 ,  H01L2224/32221 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/8384

摘要： A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.

公开(公告)号：US11919288B2

公开(公告)日：2024-03-05

申请号：US17468808

申请日：2021-09-08

申请人： DOWA METALTECH CO., LTD.

发明人： Hideyo Osanai ,  Akira Sugawara

IPC分类号： B22D19/04 ,  B23K1/19 ,  B32B9/00 ,  B32B9/04 ,  H05K1/02 ,  H05K7/20 ,  B23K1/00 ,  B23K101/36

CPC分类号： B32B9/041 ,  B22D19/04 ,  B23K1/19 ,  B32B9/007 ,  H05K1/0201 ,  H05K7/2039 ,  B23K1/0016 ,  B23K2101/36 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/302 ,  B32B2307/724 ,  B32B2457/08

摘要： To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.

公开(公告)号：US11905456B2

公开(公告)日：2024-02-20

申请号：US17033004

申请日：2020-09-25

申请人： KANEKA CORPORATION

发明人： Kensuke Murashima ,  Makoto Kutsumizu ,  Satoshi Oku ,  Katsuhiro Chikuba

IPC分类号： C09K5/14 ,  B32B9/04 ,  B32B9/00 ,  B32B37/18 ,  C01B32/205 ,  H05K7/20

CPC分类号： C09K5/14 ,  B32B9/007 ,  B32B9/041 ,  B32B37/18 ,  C01B32/205 ,  B32B2307/706 ,  C01P2002/78 ,  C01P2006/32 ,  C01P2006/90 ,  H05K7/20509

摘要： Anisotropic graphite and an anisotropic graphite composite are provided, each having excellent heat transmission performance and excellent long-term reliability as a heat transmitting element, and a production method for the anisotropic graphite composite. A face of anisotropic graphite which face is perpendicular to crystal orientation planes of graphite layers of the anisotropic graphite may be subjected to surface treatment so as to obtain anisotropic graphite having a specific surface roughness. An anisotropic graphite composite may include anisotropic graphite having an interface that has a specific interface roughness; a titanium-containing metal layer; and an inorganic material layer.

公开(公告)号：US11850773B2

公开(公告)日：2023-12-26

申请号：US17994687

申请日：2022-11-28

申请人： Tenneco Inc.

发明人： Warran Boyd Lineton ,  Ross Allen Evers ,  Greg Salenbien

IPC分类号： F02F3/12 ,  F02F3/14 ,  B29C43/18 ,  B32B3/06 ,  B29C43/52 ,  F02F3/00 ,  B32B5/00 ,  B32B27/00 ,  B32B15/20 ,  B32B15/18 ,  B32B9/04 ,  B32B7/04 ,  B32B15/16 ,  B32B9/00 ,  B32B5/02 ,  B32B7/05 ,  B32B27/06 ,  B32B15/098 ,  B32B27/42 ,  B32B5/16 ,  B32B15/14 ,  F04B53/14 ,  F02B77/02 ,  F04B39/00 ,  B29K277/00 ,  B29K709/02 ,  B29K101/10 ,  B29K475/00 ,  B29K45/00 ,  B29K105/12 ,  B29K279/00 ,  B29K307/04 ,  B29L31/00 ,  F02F3/26

CPC分类号： B29C43/18 ,  B29C43/52 ,  B32B3/06 ,  B32B5/00 ,  B32B5/02 ,  B32B5/16 ,  B32B7/04 ,  B32B7/05 ,  B32B9/005 ,  B32B9/041 ,  B32B9/045 ,  B32B9/047 ,  B32B9/048 ,  B32B15/098 ,  B32B15/14 ,  B32B15/16 ,  B32B15/18 ,  B32B15/20 ,  B32B27/00 ,  B32B27/06 ,  B32B27/42 ,  F02F3/12 ,  B29K2045/00 ,  B29K2101/10 ,  B29K2105/12 ,  B29K2277/10 ,  B29K2279/00 ,  B29K2307/04 ,  B29K2475/00 ,  B29K2709/02 ,  B29L2031/7494 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/105 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2264/107 ,  B32B2307/30 ,  B32B2307/304 ,  B32B2307/558 ,  B32B2307/732 ,  B32B2605/00 ,  F02B77/02 ,  F02F3/003 ,  F02F3/0084 ,  F02F3/14 ,  F02F3/26 ,  F02F2003/0061 ,  F04B39/0005 ,  F04B53/14 ,  F05C2203/0869 ,  F05C2225/06 ,  F05C2251/048 ,  F05C2253/12 ,  F05C2253/16 ,  F05C2253/20 ,  F05C2253/24

摘要： A piston for a heavy duty diesel engine including a composite layer forming at least a portion of a combustion surface is provided. The composite layer has a thickness greater than 500 microns and includes a mixture of components typically used to form brake pads, such as a thermoset resin, an insulating component, strengthening fibers, and an impact toughening additive. According to one example, the thermoset resin is a phenolic resin, the insulating component is a ceramic, the strengthening fibers are graphite, and the impact toughening additive is an aramid pulp of fibrillated chopped synthetic fibers. The composite layer also has a thermal conductivity of 0.8 to 5 W/m·K. The body portion of the piston can include an undercut scroll thread to improve mechanical locking of the composite layer. The piston can also include a ceramic insert between the body portion and the composite layer.

公开(公告)号：US20230399267A1

公开(公告)日：2023-12-14

申请号：US18033573

申请日：2021-10-29

申请人： AURUBIS STOLBERG GMBH & CO. KG

发明人： Benjamin CAPPI ,  Helge LEHMANN

IPC分类号： C04B37/02 ,  B32B15/20 ,  B32B9/00 ,  B32B9/04

CPC分类号： C04B37/02 ,  B32B15/20 ,  B32B9/005 ,  B32B9/041 ,  C04B2237/407 ,  B32B2307/536

摘要： The invention relates to a copper-ceramic substrate comprising a ceramic support and at least one copper layer bonded to a surface of the ceramic support, the copper layer having a Cu content of at least 99.5% Cu, the copper layer having an Ag content of at least 50 ppm, and the copper layer having an Ag content of not more than 3000 ppm.

公开(公告)号：US11841600B2

公开(公告)日：2023-12-12

申请号：US17198830

申请日：2021-03-11

申请人： SEIKO EPSON CORPORATION

发明人： Wataru Yasumatsu ,  Soma Toda

IPC分类号： G03B21/20 ,  G03B33/12 ,  B32B3/12 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  B32B7/12 ,  B32B37/12

CPC分类号： G03B21/204 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B37/12 ,  G03B33/12 ,  B32B2457/00

摘要： A wavelength conversion element according to the present disclosure includes: a wavelength conversion layer; a first substrate; a second substrate; a first intermediate layer; and a second intermediate layer. A linear expansion coefficient of the first substrate is smaller than a linear expansion coefficient of the wavelength conversion layer. The linear expansion coefficient of the wavelength conversion layer is smaller than a linear expansion coefficient of the second substrate. The linear expansion coefficient of the first substrate is smaller than the linear expansion coefficient of the second substrate. A thermal conductivity of the first substrate is larger than a thermal conductivity of the wavelength conversion layer. A thermal conductivity of the second substrate is larger than the thermal conductivity of the wavelength conversion layer.

公开(公告)号：US20230347617A1

公开(公告)日：2023-11-02

申请号：US18129075

申请日：2023-03-31

申请人： SEMES CO., LTD.

发明人： Youngjun Son ,  Sunghun Eom

IPC分类号： B32B3/08 ,  B32B9/00 ,  B32B15/02 ,  B32B1/08 ,  B32B27/32 ,  B32B9/04 ,  B32B15/085 ,  F16L11/127 ,  H10N10/13 ,  H01L21/67

CPC分类号： B32B1/08 ,  B32B3/08 ,  B32B9/007 ,  B32B9/041 ,  B32B9/043 ,  B32B15/02 ,  B32B15/085 ,  B32B27/322 ,  F16L11/127 ,  H01L21/67017 ,  H10N10/13 ,  B32B9/04 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/714 ,  B32B2597/00

摘要： A tube includes an outer layer including a first material having flexibility, an inner layer including a second material having flexibility and chemical resistance, and an intermediate layer arranged between the outer layer and the inner layer and including an electrically conductive material.