公开(公告)号：US09385025B2

公开(公告)日：2016-07-05

申请号：US14573268

申请日：2014-12-17

Applicant: GLOBALFOUNDRIES INC.

Inventor： Rajiv V. Joshi ,  Chih-Chao Yang

IPC: H01L23/525 ,  H01L21/768 ,  H01L45/00 ,  H01L27/24 ,  H01L23/532 ,  H01L27/112 ,  H01L23/522

CPC classification number: H01L21/768 ,  H01L23/5226 ,  H01L23/5256 ,  H01L23/53257 ,  H01L27/11206 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/06 ,  H01L45/1206 ,  H01L45/1226 ,  H01L45/1266 ,  H01L45/142 ,  H01L45/143 ,  H01L45/144 ,  H01L45/146 ,  H01L45/148 ,  H01L45/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Semiconductor structures are provided containing an electronic fuse (E-fuse) that includes a fuse element and at least one underlying tungsten contact that is used for programming the fuse element. In some embodiments, a pair of neighboring tungsten contacts is used for programming the fuse element. In another embodiment, an overlying conductive region can be used in conjunction with one of the underlying tungsten contacts to program the fuse element. In the disclosed structures, the fuse element is in direct contact with upper surfaces of a pair of underlying tungsten contacts. In one embodiment, the semiconductor structures may include an interconnect level located atop the fuse element. The interconnect level has a plurality of conductive regions embedded therein. In other embodiments, the fuse element is located within an interconnect level that is located atop the tungsten contacts.