公开(公告)号：US09659131B2

公开(公告)日：2017-05-23

申请号：US14754585

申请日：2015-06-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Anson Jay Call ,  Vijayeshwar Das Khanna ,  Douglas Oliver Powell ,  David John Russell

IPC: H05K1/03 ,  G06F17/50 ,  H01L23/00 ,  H01L23/498 ,  H01L23/14

CPC classification number: G06F17/5072 ,  G06F17/5009 ,  G06F2217/42 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.