公开(公告)号：US08617996B1

公开(公告)日：2013-12-31

申请号：US13738435

申请日：2013-01-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Min-hwa Chi ,  Honglian Shen ,  Changyong Xiao

IPC: H01L21/311

CPC classification number: H01L21/30604 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/823431 ,  H01L21/823821

Abstract: Methods for removal of fins from a semiconductor structure are provided. A fin liner is applied to the fins. The fin liner is then removed from the fins that are to be removed. The fin liner is of a material that is selective compared to the semiconductor fins. Hence, the fins can be removed without significant damage to the fin liner. The subsets of fins that are to be removed are then removed, while the fin liner protects the adjacent fins that are to be kept.

Abstract translation: 提供了从半导体结构中去除散热片的方法。 翅片衬垫应用于翅片。 然后将翅片衬垫从要去除的翅片上移除。 翅片衬套是与半导体翅片相比是选择性的材料。 因此，可以去除翅片而不会对翼片衬垫造成显着损坏。 然后去除要去除的翅片的子集，而翅片衬垫保护待保持的相邻翅片。