公开(公告)号：US20190101905A1

公开(公告)日：2019-04-04

申请号：US15719680

申请日：2017-09-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Hongxin Zhang ,  Shaowen Gao ,  Norman Chen

IPC: G05B19/418

CPC classification number: G05B19/41845 ,  G05B2219/36089 ,  G05B2219/45031

Abstract: Methods according to the disclosure include: converting an image of a manufactured circuit to a plurality of representative contours, the plurality of representative contours corresponding to printed features in the manufactured circuit; generating a risk inventory for the manufactured circuit based on the plurality of representative contours, the risk inventory being configured to identify at least one process sensitive geometry (PSG) in the manufactured circuit; generating a common process window (CPW) for the manufactured circuit based on the plurality of representative contours and the risk inventory, the CPW being indicative of manufacturing reliability of each feature in the manufactured circuit; and generating instructions to adjust a manufacturing tool for creating the manufactured circuit, based on the generated CPW.

公开(公告)号：US10401837B2

公开(公告)日：2019-09-03

申请号：US15719680

申请日：2017-09-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Hongxin Zhang ,  Shaowen Gao ,  Norman Chen

IPC: G05B19/418 ,  G06F17/50

Abstract: A method disclosed herein includes: converting an image of a manufactured circuit to a plurality of representative contours, the plurality of representative contours corresponding to printed features in the manufactured circuit; generating a risk inventory for the manufactured circuit based on the plurality of representative contours, the risk inventory being configured to identify at least one process sensitive geometry (PSG) in the manufactured circuit; generating a common process window (CPW) for the manufactured circuit based on the plurality of representative contours and the risk inventory, the CPW being indicative of manufacturing reliability of each feature in the manufactured circuit; and generating instructions to adjust a manufacturing tool for creating the manufactured circuit, based on the generated CPW.

公开(公告)号：US10386715B2

公开(公告)日：2019-08-20

申请号：US15730830

申请日：2017-10-12

Applicant: GLOBALFOUNDRIES INC.

Inventor： Feng Wang ,  Hongxin Zhang ,  Shaowen Gao ,  Norman Chen

IPC: G03F1/36

Abstract: A method of creating an optical proximity correction (OPC) model and assessing the model through optical rule checking (ORC) includes the introduction of post-integration, i.e., post-metallization data. High density critical dimension scanning electron microscopy and backscattered electron scanning electron microscopy from a metallized structure are used during development and verification of the model to accurately predict post-integration behavior.