公开(公告)号：US20170146592A1

公开(公告)日：2017-05-25

申请号：US14945520

申请日：2015-11-19

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Gregory G. Freeman ,  Siyuranga Koswatta ,  Paul S. McLaughlin ,  Daniel J. Poindexter ,  J. Campbell Scott ,  Scott Taylor ,  Gregory Uhlmann ,  James D. Warnock

IPC: G01R31/28

CPC classification number: G01R31/2858 ,  G01R31/2884

Abstract: A sensor for on-chip monitoring the effects of operating conditions on a circuit, Integrated Circuit (IC) chips including the sensors, and a method of monitoring operating condition effects on-chip circuits, e.g., for the occurrence of electromigration. The sensor includes a multi-fingered driver associated with a monitored circuit, sensitive to known circuit parameter sensitivities. Sense and control logic circuit selectively driving the multi-fingered driver, and selectively monitoring for an expected multi-fingered driver response.

公开(公告)号：US10191108B2

公开(公告)日：2019-01-29

申请号：US14945520

申请日：2015-11-19

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Gregory G. Freeman ,  Siyuranga Koswatta ,  Paul S. McLaughlin ,  Daniel J. Poindexter ,  J. Campbell Scott ,  Scott Taylor ,  Gregory Uhlmann ,  James D. Warnock

IPC: G01R33/36 ,  G01R31/28

Abstract: A sensor for on-chip monitoring the effects of operating conditions on a circuit, Integrated Circuit (IC) chips including the sensors, and a method of monitoring operating condition effects on-chip circuits, e.g., for the occurrence of electromigration. The sensor includes a multi-fingered driver associated with a monitored circuit, sensitive to known circuit parameter sensitivities. Sense and control logic circuit selectively driving the multi-fingered driver, and selectively monitoring for an expected multi-fingered driver response.

公开(公告)号：US09443776B2

公开(公告)日：2016-09-13

申请号：US14729446

申请日：2015-06-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ronald G. Filippi ,  Jason P. Gill ,  Vincent J. McGahay ,  Paul S. McLaughlin ,  Conal E. Murray ,  Hazara S. Rathore ,  Thomas M. Shaw ,  Ping-Chuan Wang

IPC: H01L23/00 ,  H01L21/66 ,  H01L23/522 ,  H05K1/09 ,  H05K1/02

CPC classification number: H01L22/34 ,  H01L22/32 ,  H01L23/5226 ,  H01L23/562 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/092 ,  Y10S438/927 ,  Y10T29/49004 ,  H01L2924/00

Abstract: A test structure used to determine reliability performance includes a patterned metallization structure having multiple interfaces, which provide stress risers. A dielectric material surrounds the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design.

Abstract translation: 用于确定可靠性性能的测试结构包括具有多个界面的图案化金属化结构，其提供应力梯度。 电介质材料围绕金属化结构，其中存在金属化结构和周围电介质材料之间的热膨胀系数（CTE）不匹配，使得提供热应变值以引起由于CTE失配导致的给定应力条件下的故障 以提供指示制造设计的可靠性的产量。