公开(公告)号：US20200035495A1

公开(公告)日：2020-01-30

申请号：US16045111

申请日：2018-07-25

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Dewei Xu ,  Lili Cheng ,  Shinichiro Kakita ,  Ushasree Katakamsetty ,  Roderick A. Augur

IPC: H01L21/304 ,  H01L21/306 ,  H01L21/67 ,  B24B37/005

Abstract: Apparatus and methods of chemical-mechanical polishing of a layer on a wafer. A plurality of polishers arranged on a rotating plate, and a carrier is configured to hold the wafer and to place the layer in contact with the polishers. Each polisher includes a platen and a force-applying device operatively connected to the platen, and the force-applying device is configured to apply a variable force to the platen in order to change a rate of material removal over an area of the layer on the wafer contacted by a polishing pad carried by the platen.