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公开(公告)号:US12266671B2
公开(公告)日:2025-04-01
申请号:US17507213
申请日:2021-10-21
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Eric Linardy , Eng Huat Toh , Ping Zheng , Kiok Boone Elgin Quek
IPC: H01L27/146 , H10F39/00 , H10F39/18
Abstract: Structures for a photodetector and methods of forming a structure for a photodetector. The structure includes a semiconductor layer having a p-n junction and a deep trench isolation region extending through the semiconductor layer. The deep trench isolation region includes first layers and second layers that alternate with the first layers to define a Bragg mirror. The first layers contain a first material having a first refractive index, and the second layers contain a second material having a second refractive index that is greater than the first refractive index.
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公开(公告)号:US20230065063A1
公开(公告)日:2023-03-02
申请号:US17410025
申请日:2021-08-24
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Ping Zheng , Eng Huat Toh , Eric Linardy , Kiok Boone Elgin Quek
IPC: H01L27/146
Abstract: Structures for a single-photon avalanche diode and methods of forming a structure for a single-photon avalanche diode. The structure includes a semiconductor layer having a first well and a second well defining a p-n junction with the first well, and an interlayer dielectric layer on the semiconductor layer. A deep trench isolation region includes a conductor layer and a dielectric liner. The conductor layer penetrates through the semiconductor layer and the interlayer dielectric layer. The conductor layer has a first end, a second end, and a sidewall that connects the first end to the second end. The dielectric liner is arranged to surround the sidewall of the conductor layer. A metal feature is connected to the first end of the conductor layer.
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公开(公告)号:US12183754B2
公开(公告)日:2024-12-31
申请号:US17410025
申请日:2021-08-24
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Ping Zheng , Eng Huat Toh , Eric Linardy , Kiok Boone Elgin Quek
IPC: H01L27/146 , H01L31/107
Abstract: Structures for a single-photon avalanche diode and methods of forming a structure for a single-photon avalanche diode. The structure includes a semiconductor layer having a first well and a second well defining a p-n junction with the first well, and an interlayer dielectric layer on the semiconductor layer. A deep trench isolation region includes a conductor layer and a dielectric liner. The conductor layer penetrates through the semiconductor layer and the interlayer dielectric layer. The conductor layer has a first end, a second end, and a sidewall that connects the first end to the second end. The dielectric liner is arranged to surround the sidewall of the conductor layer. A metal feature is connected to the first end of the conductor layer.
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公开(公告)号:US20230131505A1
公开(公告)日:2023-04-27
申请号:US17507213
申请日:2021-10-21
Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
Inventor: Eric Linardy , Eng Huat Toh , Ping Zheng , Kiok Boone Elgin Quek
IPC: H01L27/146
Abstract: Structures for a photodetector and methods of forming a structure for a photodetector. The structure includes a semiconductor layer having a p-n junction and a deep trench isolation region extending through the semiconductor layer. The deep trench isolation region includes first layers and second layers that alternate with the first layers to define a Bragg mirror. The first layers contain a first material having a first refractive index, and the second layers contain a second material having a second refractive index that is greater than the first refractive index.
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