ON-CHIP HEATER WITH A HEATING ELEMENT THAT LOCALLY GENERATES DIFFERENT AMOUNTS OF HEAT AND METHODS

    公开(公告)号:US20220317393A1

    公开(公告)日:2022-10-06

    申请号:US17223059

    申请日:2021-04-06

    Abstract: Disclosed is a chip structure that includes heater. The heater includes a heating element with a first end and a second end and, between the first and second ends, different portions with different cross-sectional areas. The heating element further includes first and second terminals at the first and second ends, respectively. Current flowing through the heating element between the first and second terminals causes the heating element to generate heat. However, due to the different cross-sectional areas of the different portions, the current densities through those different portions are different and, thus, the different portions of the heating element generate different amounts of heat per unit length. The heating element can be designed and placed on-chip to facilitate local thermal tuning of different regions of a device or of different devices without requiring multiple different heating elements within a relatively small chip area. Also disclosed is an associated method.

    STRUCTURE PROVIDING CHARGE CONTROLLED ELECTRONIC FUSE

    公开(公告)号:US20210399116A1

    公开(公告)日:2021-12-23

    申请号:US16907600

    申请日:2020-06-22

    Abstract: A structure includes a first source/drain region and a second source/drain region in a semiconductor body; and a trench isolation between the first and second source/drain regions in the semiconductor body. A first doping region is about the first source/drain region, a second doping region about the second source/drain region, and the trench isolation is within the second doping region. A third doping region is adjacent to the first doping region and extend partially into the second doping region to create a charge trap section. A gate conductor of a gate structure is over the trench isolation and the first, second, and third doping regions. The charge trap section creates a charge controlled e-fuse operable by applying a stress voltage to the gate conductor.

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