公开(公告)号：US20170052014A1

公开(公告)日：2017-02-23

申请号：US14830214

申请日：2015-08-19

Applicant: GLOBALFOUNRIES Inc.

Inventor： RYAN SCOTT SMITH

IPC: G01B7/14 ,  G01L1/00 ,  H01L21/67 ,  G01N27/02 ,  H01L21/66 ,  H01L23/64

CPC classification number: G01B7/14 ,  G01B7/18 ,  G01B2210/56 ,  G01L1/005 ,  H01L21/67288 ,  H01L22/12 ,  H01L22/14 ,  H01L22/34

Abstract: At least one method, apparatus, and system for determining a distance between layers of a semiconductor device and, if desired, modifying a semiconductor device manufacturing process in view of the determined distance. The system comprises and the methods make use of a test circuit comprising a resistor, at least one of an inductor and a capacitor, a first terminal and a second terminal each configured to electrically connect to a first layer circuit and a second layer circuit of a semiconductor device.

Abstract translation: 用于确定半导体器件的层之间的距离的至少一种方法，装置和系统，以及如果需要，鉴于所确定的距离来修改半导体器件制造工艺。 该系统包括并且该方法使用包括电阻器，电感器和电容器中的至少一个，第一端子和第二端子的测试电路，每个端子和第二端子被配置为电连接到第一层电路和第二层电路 半导体器件。