公开(公告)号：US20240234239A1

公开(公告)日：2024-07-11

申请号：US18150406

申请日：2023-01-05

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Muhammad Hussain Alvi ,  Junghoon Kim ,  Yilun Luo ,  Kevin David Corpetti-Vazquez

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L23/3735 ,  H01L21/4882 ,  H01L23/473 ,  H01L23/49833 ,  H01L23/49844 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2924/10161 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1432 ,  H01L2924/1433

Abstract: Aspects of the disclosure include a 1.5 sided cooled power module for enhanced cooling and gate connections. An exemplary cooled power module can include an upside direct bond copper (DBC) having a first top copper layer, a first bottom copper layer, and a first dielectric layer between the first top copper layer and the first bottom copper layer. A downside DBC includes a second top copper layer, a second bottom copper layer, and a second dielectric layer between the second top copper layer and the second bottom copper layer. One or more dies are positioned between the upside DBC and the downside DBC. The upside DBC is sized such that a portion of an uppermost surface of the one or more dies remains exposed. Bond wires are placed on the exposed portion of the one or more dies and terminated on the first top copper layer of the upside DBC.