公开(公告)号：US20210187903A1

公开(公告)日：2021-06-24

申请号：US16725807

申请日：2019-12-23

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Fang DAI ,  Mei CAI ,  Fan XU ,  Tao WANG

IPC: B32B7/12 ,  B32B15/14 ,  B32B5/02 ,  B32B27/12 ,  B32B19/04 ,  C08G77/04 ,  H01M2/10

Abstract: A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.