公开(公告)号：US20190240917A1

公开(公告)日：2019-08-08

申请号：US16339492

申请日：2017-10-06

申请人： MultiMaterial-Welding AG

发明人： Jörg Mayer ,  Martin Rhème

IPC分类号： B29C65/08 ,  B29C65/48 ,  B29C65/50

CPC分类号： B29C65/081 ,  B29C65/08 ,  B29C65/485 ,  B29C65/4865 ,  B29C65/487 ,  B29C65/4875 ,  B29C65/4885 ,  B29C65/5021 ,  B29C65/5028 ,  B29C65/5057 ,  B29C65/7826 ,  B29C66/1122 ,  B29C66/30321 ,  B29C66/30322 ,  B29C66/3034 ,  B29C66/322 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/532 ,  B29C66/54 ,  B29C66/721 ,  B29C66/742 ,  B29C66/7461 ,  B29C66/7487 ,  B29C66/81431 ,  B29C66/81821 ,  B29C66/91951 ,  B29C66/92445 ,  B29C66/92921 ,  B29K2101/12 ,  B29K2477/00 ,  C08K7/00 ,  C08K9/00 ,  C09J5/00 ,  C09J11/08 ,  C09J201/00 ,  F16B11/006

摘要： A method of fastening a second object to a first object includes: providing the first object with an attachment surface; providing the second object; placing the second object relative to the first object, with a resin composition in between the attachment surface and the second object, wherein the resin composition has a resin having a first viscosity and being in a flowable state; pressing the first and second objects against each other and causing mechanical vibration to act on at least one of the objects until the resin composition experiences a vibration induced activation, which includes at least one of reduction of the viscosity of the resin compared to the first viscosity and activation of particles dispersed in the resin. The pressing and mechanical vibration are continued or repeated until the resin has at least partially cross-linked and the viscosity of the resin is increased compared to the first viscosity.

公开(公告)号：US20140319554A1

公开(公告)日：2014-10-30

申请号：US14035481

申请日：2013-09-24

申请人： Samsung Display Co., Ltd.

发明人： Dae-Geun LEE

IPC分类号： B29C65/48 ,  H01L33/08

CPC分类号： H01B5/14 ,  B29C65/4855 ,  B29C65/487 ,  H01L23/3142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29498 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/9211 ,  Y10T156/1056 ,  Y10T428/2982 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

摘要翻译： 包括多面体形状的导电粒子，其中多个侧面中的两个相邻侧面形成交叉线，并且在交叉线上相交的两侧形成一个角度。

公开(公告)号：US20140030108A1

公开(公告)日：2014-01-30

申请号：US13945165

申请日：2013-07-18

申请人： SNECMA

发明人： Emmanuel CHICHERY

IPC分类号： B32B1/04

CPC分类号： B32B1/04 ,  B26F3/06 ,  B29C65/4855 ,  B29C65/487 ,  B29C65/4875 ,  B29C65/489 ,  B29C65/76 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/742 ,  B29K2995/0096 ,  B29L2031/08 ,  C08K3/10 ,  C08L2201/12 ,  C09J5/06 ,  C09J2205/302 ,  Y10T156/1121 ,  B29K2309/02 ,  B29K2309/04 ,  B29K2307/04

摘要： The invention provides a method of bonding a first part on a second part made of composite material by means of an adhesive, wherein said adhesive is filled with elements of shape memory alloy. The invention also provides a method of un-sticking the first part adhesively bonded on the composite material second part, said un-sticking method comprising a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

摘要翻译： 本发明提供一种通过粘合剂将由复合材料制成的第二部分接合第一部分的方法，其中所述粘合剂填充有形状记忆合金的元素。 本发明还提供一种将粘接在复合材料第二部分上的第一部分不粘附的方法，所述不粘方法包括使粘合界面变弱的步骤，该粘合界面包括使粘合部分在温度下进行热处理 低于或高于形状记忆合金元件的马氏体相变温度。

公开(公告)号：US09368255B2

公开(公告)日：2016-06-14

申请号：US14677685

申请日：2015-04-02

申请人： Samsung Display Co., Ltd.

发明人： Dae-Geun Lee

IPC分类号： H01L29/04 ,  H01B5/14 ,  B29C65/48 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01B5/14 ,  B29C65/4855 ,  B29C65/487 ,  H01L23/3142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29498 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/9211 ,  Y10T156/1056 ,  Y10T428/2982 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

公开(公告)号：US09328266B2

公开(公告)日：2016-05-03

申请号：US13657245

申请日：2012-10-22

申请人： GM Global Technology Operations LLC

发明人： Sampath K. Vanimisetti ,  Chen-Shih Wang ,  Vidyashankar R. Buravalla

IPC分类号： C08J9/32 ,  C09J11/04 ,  C08K7/24 ,  B29K105/16 ,  B29C65/48 ,  B29C65/00 ,  B29C61/00

CPC分类号： C09J11/04 ,  B29C61/00 ,  B29C65/4835 ,  B29C65/4855 ,  B29C65/487 ,  B29C65/489 ,  B29C66/006 ,  B29C66/721 ,  B29C66/7311 ,  B29C66/7315 ,  B29C66/73941 ,  B29K2105/165 ,  B29K2995/0096 ,  C08K7/24 ,  Y10T428/249984

摘要： A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

摘要翻译： 热固性聚合物复合组合物（例如热固性SMC组合物）或在热固性聚合物复合组合物或粘合剂组合物中含有体积小的中空形状记忆合金颗粒的热固性粘合剂组合物在固化过程中在高于 颗粒的转变温度。

公开(公告)号：US20150213919A1

公开(公告)日：2015-07-30

申请号：US14677685

申请日：2015-04-02

申请人： Samsung Display Co., Ltd.

发明人： Dae-Geun LEE

IPC分类号： H01B5/14

CPC分类号： H01B5/14 ,  B29C65/4855 ,  B29C65/487 ,  H01L23/3142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29498 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/9211 ,  Y10T156/1056 ,  Y10T428/2982 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

摘要翻译： 包括多面体形状的导电粒子，其中多个侧面中的两个相邻侧面形成交叉线，并且在交叉线上相交的两侧形成一个角度。

公开(公告)号：US10059088B2

公开(公告)日：2018-08-28

申请号：US14857036

申请日：2015-09-17

申请人： LISA DRAEXLMAIER GMBH

发明人： Wolfgang Fischer ,  Stephanie Reisinger ,  Robert Magunia

IPC分类号： B32B37/06 ,  B32B37/08 ,  B32B37/12 ,  B29C63/04 ,  B29C65/36 ,  B29C65/14 ,  B29C65/48 ,  B29C65/00 ,  B29C63/00 ,  B29K507/04 ,  B29K105/16

CPC分类号： B32B37/08 ,  B29C63/0065 ,  B29C63/0073 ,  B29C63/04 ,  B29C65/1412 ,  B29C65/1425 ,  B29C65/1435 ,  B29C65/1483 ,  B29C65/3612 ,  B29C65/3684 ,  B29C65/3696 ,  B29C65/4835 ,  B29C65/4845 ,  B29C65/487 ,  B29C65/488 ,  B29C65/4885 ,  B29C66/301 ,  B29C66/723 ,  B29C66/81267 ,  B29C66/8322 ,  B29K2105/167 ,  B29K2507/04 ,  B32B37/06 ,  B32B37/12 ,  B32B2310/0806 ,  B32B2605/003 ,  Y10T428/24628

摘要： A process for laminating a material layer to a support including: providing the support, applying the material layer to the support, a heat-activatable adhesive being applied to s side of the material layer facing the dimensionally stable support and/or to the side of the dimensionally stable support facing the material layer, pressing the flexible material layer and the dimensionally stable support together by means of a lower dimensionally stable mold half and an upper dimensionally stable mold half, irradiating the mold halves, the support and the material layer with electromagnetic radiation, in particular with microwave radiation, high-frequency radiation or induction radiation, whereby the adhesive is activated directly or indirectly.

公开(公告)号：US09290607B2

公开(公告)日：2016-03-22

申请号：US13885279

申请日：2011-11-23

申请人： Gary L Jialanella ,  Toni Ristoski ,  Mike Frishcosy

发明人： Gary L Jialanella ,  Toni Ristoski ,  Mike Frishcosy

IPC分类号： B29C65/00 ,  B29C65/48 ,  B32B17/00 ,  B32B17/10 ,  B32B27/00 ,  B32B27/40 ,  B32B37/00 ,  B60J1/00 ,  C08G18/00 ,  C08G18/08 ,  C08G18/28 ,  C08G18/77 ,  C08K3/04 ,  C08L75/00 ,  C09J4/00 ,  C09J101/00 ,  C09J201/00 ,  E06B3/00 ,  E06B3/964 ,  E06B5/00 ,  E06B7/00 ,  E06B3/64 ,  C09J175/12 ,  E06B3/56 ,  B32B17/06 ,  B32B37/12 ,  C08G18/10 ,  C08G18/12 ,  C08G18/20 ,  C08K13/02 ,  C08L75/04 ,  C09J175/04 ,  C08K5/3435 ,  C09J5/00 ,  C09J175/02 ,  C08K5/00 ,  C08K5/32

CPC分类号： C08G18/778 ,  B29C65/00 ,  B29C65/48 ,  B29C65/485 ,  B29C65/4865 ,  B29C65/487 ,  B29C65/4875 ,  B32B17/00 ,  B32B17/061 ,  B32B17/10 ,  B32B27/00 ,  B32B27/40 ,  B32B37/00 ,  B32B37/12 ,  B60J1/00 ,  C08G18/10 ,  C08G18/12 ,  C08G18/2081 ,  C08K3/04 ,  C08K5/005 ,  C08K5/32 ,  C08K5/3435 ,  C08K13/02 ,  C08L75/04 ,  C09J5/00 ,  C09J175/02 ,  C09J175/04 ,  C09J175/12 ,  E06B3/56 ,  E06B3/64 ,  C08G18/307

摘要： A composition comprising: a) one or more isocyanate functional prepolymers; b) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups; c) one or more reinforcing fillers; and d) a stabilizing amount of one or more compounds comprising a dihydrocarbyl hydroxylamine, an alicyclic hydroxylamine, a nitrile oxide of a dihydrocarbyl hydroxylamine or a nitrile oxide of an alicyclic hydroxylamine. In another embodiment the invention is a method of bonding two or more substrates together which comprises contacting the two or more substrates together with a composition according to this invention disposed along at least a portion of the area wherein the substrates are in contact. The compositions of the invention are useful as an adhesive to bond substrates together.

摘要翻译： 一种组合物，其包含：a）一种或多种异氰酸酯官能预聚物; b）用于使异氰酸酯部分与羟基反应的一种或多种催化剂; c）一种或多种增强填料; 和d）稳定量的一种或多种包含二烃基羟胺，脂环羟胺，二烃基羟胺的腈氧化物或脂环羟胺的腈氧化物的化合物。 在另一个实施方案中，本发明是一种将两个或更多个基底结合在一起的方法，其包括使两个或更多个基底与沿着其中基底接触的区域的至少一部分布置的根据本发明的组合物接触。 本发明的组合物可用作将基底粘合在一起的粘合剂。

公开(公告)号：US20140011016A1

公开(公告)日：2014-01-09

申请号：US13657245

申请日：2012-10-22

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Sampath K. VANIMISETTI ,  Chen-Shih WANG ,  Vidyashankar R. BURAVALLA

IPC分类号： C08K7/24 ,  B32B7/12 ,  B32B37/12 ,  C09J11/08

CPC分类号： C09J11/04 ,  B29C61/00 ,  B29C65/4835 ,  B29C65/4855 ,  B29C65/487 ,  B29C65/489 ,  B29C66/006 ,  B29C66/721 ,  B29C66/7311 ,  B29C66/7315 ,  B29C66/73941 ,  B29K2105/165 ,  B29K2995/0096 ,  C08K7/24 ,  Y10T428/249984

摘要： A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

摘要翻译： 热固性聚合物复合组合物（例如热固性SMC组合物）或在热固性聚合物复合组合物或粘合剂组合物中含有体积小的中空形状记忆合金颗粒的热固性粘合剂组合物在固化过程中在高于 颗粒的转变温度。

公开(公告)号：US5732459A

公开(公告)日：1998-03-31

申请号：US590284

申请日：1996-01-23

申请人： Masashi Shiraishi ,  Masaharu Ishizuka ,  Noboru Shinohara

发明人： Masashi Shiraishi ,  Masaharu Ishizuka ,  Noboru Shinohara

IPC分类号： B29C65/36 ,  C08L63/00 ,  C09J5/06 ,  G11B5/48 ,  G11B21/16

CPC分类号： C09J5/06 ,  B29C65/3612 ,  B29C65/4835 ,  B29C65/489 ,  B29C66/91221 ,  B29C66/91411 ,  B29C66/91653 ,  B29C66/91655 ,  B29C66/961 ,  B29C65/487 ,  B29C66/71 ,  C08L63/00 ,  C09J2463/00 ,  Y10S29/001 ,  Y10T29/4903 ,  Y10T29/53265

摘要： A method for fixing members includes a step of inserting a conductive thermosetting adhesive between the members to be bonded with each other, and a step of flowing a current directly through the conductive thermosetting adhesive so that the adhesive is cured itself due to Joule effect caused by the current flowed through the adhesive.

摘要翻译： 一种固定构件的方法包括将导电性热固性粘合剂插入待接合的构件之间的步骤，以及使电流直接通过导电性热固性粘合剂使得粘合剂由于焦耳效应而自身固化的步骤 电流流过粘合剂。