HEADSET
    1.
    发明公开
    HEADSET 审中-公开

    公开(公告)号:US20240187772A1

    公开(公告)日:2024-06-06

    申请号:US18496200

    申请日:2023-10-27

    Applicant: GN Audio A/S

    Inventor: Boris STANKOVIC

    CPC classification number: H04R1/1008 H04R1/1041

    Abstract: A headset comprising a first earcup comprising a first capacitive sensor a second earcup comprising a second capacitive sensor, and a headband comprising a third capacitive sensor. A processor of the headset being configured to receive capacitive information from the first capacitive sensor, the second capacitive sensor, and the third capacitive sensor, to determine whether the first capacitive sensor, the second capacitive sensor, and the third capacitive sensor are capacitively coupled to a user wearing the headset based on the received capacitive information, and to set the headset to a first active mode, if the first capacitive sensor, the second capacitive sensor, and the third capacitive sensor are determined to be capacitively coupled to the user wearing the headset.

    HEADSET WITH CAPACITIVE SENSOR
    2.
    发明公开

    公开(公告)号:US20240015430A1

    公开(公告)日:2024-01-11

    申请号:US18334119

    申请日:2023-06-13

    Applicant: GN Audio A/S

    Inventor: Boris STANKOVIC

    CPC classification number: H04R1/1041 H03K17/955 H04R1/1008 D03D1/0088

    Abstract: The present disclosure relates to a headset with first earcup comprising a first electrically conductive material forming a first sense electrode. The first sense electrode is configured for capacitively-coupling to skin of a user of the headset when the user is wearing the headset. The first electrically conductive material is a flexible material configured to deform dependent on a head shape and/or an ear shape of a user of the headset when the user is wearing the headset.

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