公开(公告)号：US20230269506A1

公开(公告)日：2023-08-24

申请号：US18307411

申请日：2023-04-26

Applicant: GOERTEK MICROELECTRONICS INC.

Inventor： Huabin FANG ,  Luyu DUANMU

IPC: H04R1/08 ,  H04R1/04 ,  H04R3/00

CPC classification number: H04R1/08 ,  H04R1/04 ,  H04R3/00

Abstract: A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup unit includes a second casing with an open end and an elastic vibration pickup member arranged in the second casing, the open end of the second casing is arranged on the substrate or the first top plate, and the second casing is provided with a vibration transmission through hole. The sensor unit includes a sensor chip arranged on an outer surface of the second casing, and a back cavity of the sensor chip corresponds to the vibration transmission through hole.