METHOD OF CONDUCTOR MANAGEMENT WITHIN A MEDICAL DEVICE

    公开(公告)号:US20220142542A1

    公开(公告)日:2022-05-12

    申请号:US17520522

    申请日:2021-11-05

    Abstract: In various examples, a method of conductor management within a medical device includes providing a flexible substrate. The flexible substrate includes at least one routing feature. A hole is cut in the at least one routing feature with a cutting device. A conductor is passed through the hole in the at least one routing feature. The routing feature acts to maintain and manage positioning of the conductor within the medical device. The medical device, in some examples, includes a lead, with the conductor connected to an electrode of the lead after being routed through the routing feature.

Patent Agency Ranking