METHOD OF CONDUCTOR MANAGEMENT WITHIN A MEDICAL DEVICE

    公开(公告)号:US20220142542A1

    公开(公告)日:2022-05-12

    申请号:US17520522

    申请日:2021-11-05

    Abstract: In various examples, a method of conductor management within a medical device includes providing a flexible substrate. The flexible substrate includes at least one routing feature. A hole is cut in the at least one routing feature with a cutting device. A conductor is passed through the hole in the at least one routing feature. The routing feature acts to maintain and manage positioning of the conductor within the medical device. The medical device, in some examples, includes a lead, with the conductor connected to an electrode of the lead after being routed through the routing feature.

    INTEGRATED ELECTRODE FOR MEDICAL DEVICE

    公开(公告)号:US20250135192A1

    公开(公告)日:2025-05-01

    申请号:US18921125

    申请日:2024-10-21

    Abstract: In various examples, an electrode for a medical device is described. The medical device includes a lead. The electrode includes a tubular ring formed from a conductive material. The ring extending around a perimeter of the electrode. The ring defines a void within the ring. The void is configured to accept overmolded material of the lead therein to anchor the electrode within the lead. An electrode surface is associated with the ring. The electrode surface is configured to contact and stimulate tissue of a patient with the lead implanted within the patient.

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