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公开(公告)号:US10014473B2
公开(公告)日:2018-07-03
申请号:US15288420
申请日:2016-10-07
发明人: Heung Cho Ko , Jongwon Yoon , Yunkyung Jeong , Seonggwang Yoo , Heeje Kim , Youngkyu Hwang
CPC分类号: H01L51/0013 , B32B5/024 , B32B2262/02 , B41M5/382 , H01L51/0015 , H01L51/0016 , H01L51/0017 , H01L51/0023 , H01L51/0097 , Y02E10/549
摘要: The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.