公开(公告)号：US20130013240A1

公开(公告)日：2013-01-10

申请号：US13617950

申请日：2012-09-14

申请人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

发明人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

IPC分类号： G01N37/00 ,  G06F19/00

CPC分类号： G05B19/4065 ,  G05B2219/32226 ,  Y02P90/14

摘要： A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

摘要翻译： 半导体制造系统包括用于检查执行系统的装置的程序：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是自动还是手动执行; 接收检查开始命令并从存储单元读取第一检查项目。 该程序还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目并自动; （b）读出的检查项目是操作项目和手册; （c）读出检查项目为检查项目并自动; 和（d）读出的检查项目是检查项目和手册。

公开(公告)号：US09223305B2

公开(公告)日：2015-12-29

申请号：US13617950

申请日：2012-09-14

申请人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

发明人： Gaku Ikeda ,  Koichi Miyashita ,  Takamasa Chikuma ,  Satoshi Gomi ,  Chunmui Li ,  Kunio Takano

IPC分类号： G01N21/88 ,  G01N21/75 ,  G01N21/95 ,  G06F3/00 ,  G05B19/4065

CPC分类号： G05B19/4065 ,  G05B2219/32226 ,  Y02P90/14

摘要： A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.

摘要翻译： 半导体制造系统包括：电路，被配置为执行：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是“自动”还是“手动”执行; 接收检查开始命令并从存储单元读取第一检查项目。 电路还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目和“自动”; （b）作为操作项目的读出检查项目和“手册”; （c）读出的检查项目是检查项目和“自动”; 和（d）读出的检查项目是检查项目和“手册”。

公开(公告)号：US20110174800A1

公开(公告)日：2011-07-21

申请号：US13000140

申请日：2009-09-25

申请人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

发明人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

IPC分类号： H05B3/68

CPC分类号： H01L21/67259 ,  C23C16/4583 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/52

摘要： A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.

摘要翻译： 当放置加热器6a，6b的衬底W上的衬底W进行加热时，检测衬底W的异常放置的方法。 检测基板的异常放置的方法包括以下步骤：在基板W的处理期间，基于关于加热器6a，6b的电输出的信息或关于基板台3的测量温度的信息，检测基板 电输出或测量温度的最大值和最小值，或电输出或测量温度的积分值; 以及基于检测到的最大值和最小值或检测到的积分值判断基板的异常放置。

公开(公告)号：US08581153B2

公开(公告)日：2013-11-12

申请号：US13000140

申请日：2009-09-25

申请人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

发明人： Takashi Chino ,  Satoshi Gomi ,  Koichi Miyashita ,  Minoru Nagasawa ,  Yoshie Eda

IPC分类号： H05B3/68

CPC分类号： H01L21/67259 ,  C23C16/4583 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/52

摘要： A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.

摘要翻译： 当放置加热器6a，6b的衬底W上的衬底W进行加热时，检测衬底W的异常放置的方法。 检测基板的异常放置的方法包括以下步骤：在基板W的处理期间，基于关于加热器6a，6b的电输出的信息或关于基板台3的测量温度的信息，检测基板 电输出或测量温度的最大值和最小值，或电输出或测量温度的积分值; 以及基于检测到的最大值和最小值或检测到的积分值判断基板的异常放置。