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    Mechanical Housing
    1.
    发明申请
    Mechanical Housing 审中-公开
    机械住房

    公开(公告)号：US20070127212A1

    公开(公告)日：2007-06-07

    申请号：US11456270

    申请日：2006-07-10

    申请人： Gary Gustine ,  Charles Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

    发明人： Gary Gustine ,  Charles Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

    摘要： An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

    摘要翻译： 用于容纳诸如电子电路卡的物体的装置及其制造方法，该装置具有壳体; 设置在所述壳体内的至少一个壳体，所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架，所述框架内的所述区域由第一分区分成两个区域，所述两个区域中的每一个被划分为多个 通过多个第二分区，每个第二分区热耦合到框架和第一分区，每个部分被划分成多个狭槽，每个狭槽具有设置在其中的物体，用于在第一分隔件之间进行热接触， 第二分区，以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器，所述散热器热耦合到壳体和壳体。

    MECHANICAL HOUSING
    2.
    发明申请
    MECHANICAL HOUSING 有权
    机械房

    公开(公告)号：US20080239674A1

    公开(公告)日：2008-10-02

    申请号：US11932103

    申请日：2007-10-31

    申请人： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

    发明人： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

    摘要： An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

    摘要翻译： 用于容纳诸如电子电路卡的物体的装置及其制造方法，该装置具有壳体; 设置在所述壳体内的至少一个壳体，所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架，所述框架内的所述区域由第一分区分成两个区域，所述两个区域中的每一个被划分为多个 通过多个第二分区，每个第二分区热耦合到框架和第一分区，每个部分被划分成多个狭槽，每个狭槽具有设置在其中的物体，用于在第一分隔件之间进行热接触， 第二分区，以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器，所述散热器热耦合到壳体和壳体。