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公开(公告)号：US10120102B2
公开(公告)日：2018-11-06
申请号：US14932732
申请日：2015-11-04
发明人： Loucas Tsakalakos , Slawomir Rubinsztajn , Renato Guida , Mahadevan Balasubramaniam , Boon Kwee Lee , Brian Magann Rush , Faisal Razi Ahmad , Sudeep Mandal , David Sirda Shanks
摘要： A fluid sensor cable assembly and method uses one or more conductive bodies extending along an elongated core body for conducting a heating current to heat the cable assembly. The one or more conductive bodies also are configured to conduct an interrogation signal and to conduct reflections of the interrogation signal. One or more optical fibers extend along the length of the core body and include temperature sensitive elements at different locations along the length of the core body. The temperature sensitive elements measure heat flux out of the cable assembly at the different locations subsequent to heating the cable assembly and communicate the heat flux to a computer acquisition system.
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公开(公告)号：US09534855B2
公开(公告)日：2017-01-03
申请号：US14549268
申请日：2014-11-20
发明人： Shakti Singh Chauhan , Kaustubh Ravindra Nagarkar , Matthew Jeremiah Misner , Faisal Razi Ahmad
CPC分类号： F28F21/02 , B22F1/0018 , B22F3/11 , B22F3/1115 , B22F3/1137 , B22F3/114 , B22F3/24 , B22F7/00 , B22F7/02 , B22F2001/0037 , B22F2998/10 , F28F13/003 , F28F21/00 , F28F21/067 , F28F2255/18 , H01L23/3733 , Y10T428/249955 , Y10T428/249958 , Y10T428/249978 , B22F3/10 , B22F2003/244 , B22F3/26 , B22F2007/045
摘要： Composite foams are provided including a metal template and a conformal atomic-scale film disposed over such metal template to form a 3-dimensional interconnected structure. The metal template includes a plurality of sintered interconnects, having a plurality of first non-spherical pores, a first non-spherical porosity, and a first surface-area-to-volume ratio. The conformal atomic-scale film has a plurality of second non-spherical pores, a second non-spherical porosity, and a second surface-area-to-volume ratio approximately equal to the first surface-area-to-volume ratio. The plurality of sintered interconnects has a plurality of dendritic particles and the conformal atomic-scale film includes at least one of a layer of graphene and a layer of hexagonal boron nitride.
摘要翻译： 提供了复合泡沫，其包括设置在这种金属模板上的金属模板和保形原子级膜以形成3维互连结构。 金属模板包括具有多个第一非球形孔，多个第一非球形孔隙和第一表面积与体积比的多个烧结互连。 保形原子级膜具有多个第二非球形孔，第二非球形孔隙率和大约等于第一表面积体积比的第二表面积体积比。 多个烧结互连具有多个树枝状颗粒，并且共形原子尺度膜包括石墨烯层和六方氮化硼层中的至少一个。
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公开(公告)号：US20140094025A1
公开(公告)日：2014-04-03
申请号：US13630231
申请日：2012-09-28
IPC分类号： H01L21/225
CPC分类号： H01L31/1828 , H01L21/02422 , H01L21/02472 , H01L21/02474 , H01L21/02483 , H01L21/02505 , H01L21/02562 , H01L21/02614 , H01L31/0322 , H01L31/073 , Y02E10/541 , Y02E10/543
摘要： A method for processing a semiconductor assembly is presented. The method includes: (a) contacting at least a portion of a semiconductor assembly with a chalcogen source, wherein the semiconductor assembly comprises a semiconductor layer comprising a semiconductor material disposed on a support; (b) introducing a chalcogen from the chalcogen source into at least a portion of the semiconductor material; and (c) disposing a window layer on the semiconductor layer after the step (b).
摘要翻译： 提出了一种处理半导体组件的方法。 该方法包括：（a）使半导体组件的至少一部分与硫属元素源接触，其中半导体组件包括半导体层，该半导体层包括设置在支撑体上的半导体材料; （b）将硫属元素从硫族元素源引入到半导体材料的至少一部分中; 和（c）在步骤（b）之后在半导体层上设置窗口层。
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4.发明申请公开(公告)号：US20160146556A1
公开(公告)日：2016-05-26
申请号：US14549268
申请日：2014-11-20
发明人： Shakti Singh Chauhan , Kaustubh Ravindra Nagarkar , Matthew Jeremiah Misner , Faisal Razi Ahmad
CPC分类号： F28F21/02 , B22F1/0018 , B22F3/11 , B22F3/1115 , B22F3/1137 , B22F3/114 , B22F3/24 , B22F7/00 , B22F7/02 , B22F2001/0037 , B22F2998/10 , F28F13/003 , F28F21/00 , F28F21/067 , F28F2255/18 , H01L23/3733 , Y10T428/249955 , Y10T428/249958 , Y10T428/249978 , B22F3/10 , B22F2003/244 , B22F3/26 , B22F2007/045
摘要： Composite foams are provided including a metal template and a conformal atomic-scale film disposed over such metal template to form a 3-dimensional interconnected structure. The metal template includes a plurality of sintered interconnects, having a plurality of first non-spherical pores, a first non-spherical porosity, and a first surface-area-to-volume ratio. The conformal atomic-scale film has a plurality of second non-spherical pores, a second non-spherical porosity, and a second surface-area-to-volume ratio approximately equal to the first surface-area-to-volume ratio. The plurality of sintered interconnects has a plurality of dendritic particles and the conformal atomic-scale film includes at least one of a layer of graphene and a layer of hexagonal boron nitride.
摘要翻译： 提供了复合泡沫，其包括设置在这种金属模板上的金属模板和保形原子级膜以形成3维互连结构。 金属模板包括具有多个第一非球形孔，多个第一非球形孔隙和第一表面积与体积比的多个烧结互连。 保形原子级膜具有多个第二非球形孔，第二非球形孔隙率和大约等于第一表面积体积比的第二表面积体积比。 多个烧结互连具有多个树枝状颗粒，并且共形原子尺度膜包括石墨烯层和六方氮化硼层中的至少一个。
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公开(公告)号：US20170123103A1
公开(公告)日：2017-05-04
申请号：US14932732
申请日：2015-11-04
发明人： Loucas Tsakalakos , Slawomir Rubinsztajn , Renato Guida , Mahadevan Balasubramaniam , Boon Kwee Lee , Brian Magann Rush , Faisal Razi Ahmad , Sudeep Mandal , David Sirda Shanks
CPC分类号： G01V9/005 , E21B47/06 , E21B47/1005 , G01F1/6884 , G01F1/74 , G01N9/04 , G01N25/00 , G01N27/02
摘要： A fluid sensor cable assembly and method uses one or more conductive bodies extending along an elongated core body for conducting a heating current to heat the cable assembly. The one or more conductive bodies also are configured to conduct an interrogation signal and to conduct reflections of the interrogation signal. One or more optical fibers extend along the length of the core body and include temperature sensitive elements at different locations along the length of the core body. The temperature sensitive elements measure heat flux out of the cable assembly at the different locations subsequent to heating the cable assembly and communicate the heat flux to a computer acquisition system.
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