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公开(公告)号:US12132129B2
公开(公告)日:2024-10-29
申请号:US17759840
申请日:2021-02-15
Applicant: Alliance for Sustainable Energy, LLC
Inventor: Christopher Paul Muzzillo , Matthew Owen Reese
IPC: H01L31/0463 , G03F7/004 , H01L31/18
CPC classification number: H01L31/0463 , G03F7/0043 , H01L31/1828 , H01L31/1884
Abstract: Disclosed herein are methods for using cracked film lithography (CFL) for patterning transparent conductive metal grids. CFL can be vacuum- and Ag-free, and it forms more durable grids than nanowire approaches.
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公开(公告)号:US12002895B2
公开(公告)日:2024-06-04
申请号:US16926581
申请日:2020-07-10
Applicant: FLISOM AG
Inventor: Louis Schar , Thomas Netter
IPC: H01L31/0465 , B32B37/26 , B32B38/00 , H01L31/02 , H01L31/042 , H01L31/048 , H01L31/054 , H01L31/18
CPC classification number: H01L31/0465 , B32B37/26 , H01L31/0201 , H01L31/042 , H01L31/048 , H01L31/0543 , H01L31/186 , H01L31/1876 , H01L31/1896 , B32B2038/0072 , B32B2305/22 , B32B2457/12 , H01L31/1828 , Y02E10/52
Abstract: A photovoltaic apparatus is provided including a back sheet and a photovoltaic device disposed over the back sheet. The photovoltaic device includes an array of photovoltaic cells extending in a first direction; and a plurality of serial interconnects having a length that extends in a second direction, wherein each serial interconnect is disposed between and electrically connects consecutive photovoltaic cells of the array. The photovoltaic apparatus further includes a front sheet disposed over the photovoltaic device, the front sheet having a plurality of structures, wherein each structure has one or more edges aligned with one of the serial interconnects.
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公开(公告)号:US11791427B2
公开(公告)日:2023-10-17
申请号:US17509710
申请日:2021-10-25
Applicant: First Solar, Inc.
Inventor: Sachit Grover , Stuart Irvine , Xiaoping Li , Roger Malik , Shahram Seyedmohammadi , Gang Xiong , Wei Zhang
IPC: H01L31/0296 , H01L31/18
CPC classification number: H01L31/02963 , H01L31/1828 , H01L31/1864
Abstract: Provided are structures and methods for doping polycrystalline thin film semiconductor materials in photovoltaic devices. Embodiments include methods for forming and treating a photovoltaic semiconductor absorber layer.
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公开(公告)号:US20230317864A1
公开(公告)日:2023-10-05
申请号:US18206430
申请日:2023-06-06
Applicant: First Solar, Inc.
Inventor: Upali Jayamaha , Michael T. Steele , Syed Zafar
IPC: H01L31/0224 , H01L31/0749 , H01L31/18
CPC classification number: H01L31/022425 , H01L31/0749 , H01L31/1828 , Y02E10/50 , H01L31/1884
Abstract: A photovoltaic cell can include a nitrogen-containing metal layer in contact with a semiconductor layer.
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公开(公告)号:US20230187572A1
公开(公告)日:2023-06-15
申请号:US18105512
申请日:2023-02-03
Applicant: First Solar, Inc.
Inventor: Nikhil Bhandari , Charles Wickersham
IPC: H01L31/18 , H01L31/0216 , H01L31/0224 , H01L31/0296 , H01L31/05
CPC classification number: H01L31/186 , H01L31/0296 , H01L31/0516 , H01L31/1828 , H01L31/02167 , H01L31/022466
Abstract: According to the embodiments provided herein, a method for scribing a layer stack of a photovoltaic device can include directing a laser scribing waveform to a film side of a layer stack. The laser scribing waveform can include pulse groupings that repeat at a group repetition period of greater than or equal to 1.5 µs. Each pulse of the pulse groupings can have a pulse width of less than or equal to 900 fs.
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公开(公告)号:US10062800B2
公开(公告)日:2018-08-28
申请号:US13912782
申请日:2013-06-07
Applicant: First Solar, Inc.
Inventor: Holly Ann Blaydes , Kristian William Andreini , William Hullinger Huber , Eugene Thomas Hinners , Joseph John Shiang , Yong Liang , Jongwoo Choi , Adam Fraser Halverson
IPC: H01L31/0272 , H01L31/18 , H01L31/0224 , H01L31/0296 , H01L31/065 , H01L31/073
CPC classification number: H01L31/1828 , H01L31/022425 , H01L31/02966 , H01L31/065 , H01L31/073 , H01L31/1832 , Y02E10/543 , Y02P70/521
Abstract: A photovoltaic device is presented. The photovoltaic device includes a layer stack; and an absorber layer is disposed on the layer stack. The absorber layer includes selenium, and an atomic concentration of selenium varies non-linearly across a thickness of the absorber layer. A method of making a photovoltaic device is also presented.
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公开(公告)号:US10007057B2
公开(公告)日:2018-06-26
申请号:US15347314
申请日:2016-11-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Russell A. Budd , Effendi Leobandung , Ning Li , Jean-Olivier Plouchart , Devendra K. Sadana
IPC: G02B6/12 , G02B6/122 , G02B6/42 , H01L31/0216 , H01L31/103 , H01L31/18 , G02B6/132
CPC classification number: G02B6/12004 , G02B6/12002 , G02B6/122 , G02B6/132 , G02B6/4201 , G02B6/428 , G02B2006/12121 , G02B2006/12123 , G02B2006/12176 , H01L31/02161 , H01L31/1035 , H01L31/1828 , H01L31/184
Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.
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公开(公告)号:US09972739B2
公开(公告)日:2018-05-15
申请号:US14825581
申请日:2015-08-13
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Ki Yon Park , Hwa Mok Kim , Young Hwan Son , Daewoong Suh
IPC: H01L21/00 , H01L31/18 , H01L31/108 , H01L31/0224 , H01L31/0352 , H01L31/0392
CPC classification number: H01L31/1828 , H01L31/022483 , H01L31/03529 , H01L31/0392 , H01L31/108 , H01L31/1832 , Y02E10/50 , Y02E10/52
Abstract: A method of forming a light detection device includes forming a non-porous layer on a substrate, forming a light absorption layer on the non-porous layer, the light absorption layer including pores formed in a surface thereof, forming a Schottky layer on the surface of the light absorption layer and in the pores thereof, and forming a first electrode layer on the Schottky layer.
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公开(公告)号:US09952337B2
公开(公告)日:2018-04-24
申请号:US14474214
申请日:2014-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seung-hyup Lee , Sun-il Kim , Young Kim , Chang-jung Kim
IPC: G01T1/24 , H01L31/032 , H01L27/146 , H01L31/08 , G01N23/04 , G01T1/202 , H01L31/0272 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/0336 , H01L31/18 , H01L31/20 , H01L31/0384
CPC classification number: G01T1/24 , G01N23/04 , G01T1/2023 , H01L27/14676 , H01L27/14683 , H01L31/0272 , H01L31/028 , H01L31/0296 , H01L31/02966 , H01L31/0304 , H01L31/032 , H01L31/0324 , H01L31/0336 , H01L31/03845 , H01L31/085 , H01L31/18 , H01L31/1828 , H01L31/1832 , H01L31/202
Abstract: A radiation detector may include: a first photoconductor layer including a plurality of photosensitive particles; and/or a second photoconductor layer on the first photoconductor layer, and including a plurality of crystals obtained by crystal-growing photosensitive material. At least some of the plurality of photosensitive particles of the first photoconductor layer may fill gaps between the plurality of crystals of the second photoconductor layer. A method of manufacturing a radiation detector may include: forming a first photoconductor layer by applying paste, including solvent mixed with a plurality of photosensitive particles, to a first substrate; forming a second photoconductor layer by crystal-growing photosensitive material on a second substrate; pressing the crystal-grown second photoconductor layer on the first photoconductor layer that is applied to the first substrate; and/or removing the solvent in the first photoconductor layer via a drying process.
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公开(公告)号:US09915567B2
公开(公告)日:2018-03-13
申请号:US15194753
申请日:2016-06-28
Applicant: Excelitas Technologies Singapore Pte Ltd.
Inventor: Piotr Kropelnicki , Radu M. Marinescu , Grigore D. Huminic , Hermann Karagoezoglu , Kai Liang Chuan
CPC classification number: G01J5/12 , G01J5/024 , G01J5/061 , G01J2005/065 , H01L31/09 , H01L31/1804 , H01L31/1828 , H01L31/1856 , H01L35/32 , H01L35/34
Abstract: An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.
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