公开(公告)号：USRE45376E1

公开(公告)日：2015-02-17

申请号：US14072903

申请日：2013-11-06

Applicant: General Electric Company

Inventor： Mehmet Arik ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz

IPC: F28F13/02 ,  F28F13/12 ,  H05K7/20 ,  F28F13/08 ,  F28F13/10

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

Abstract translation: 在一个实施例中，公开了一种冷却系统。 冷却系统包括：用于接收冷却介质的冷却通道，设置在冷却通道附近的基板以及设置在基板内并与冷却通道流体连通的流体射流。 冷却通道用于与要冷却的部件进行热连通。 冷却通道的高度小于或等于约3mm，宽度小于或等于2mm。 流体射流包括由阱和膜限定的空腔。 在一个实施例中，一种冷却电气部件的方法包括：使冷却介质通过冷却通道，将冷却介质拉入一个或多个流体喷流中，将冷却介质从一个或多个流体喷流排出到冷却通道 并且从电气部件去除热能。