公开(公告)号：US08199505B2

公开(公告)日：2012-06-12

申请号：US12880386

申请日：2010-09-13

Applicant: Ercan Mehmet Dede

Inventor： Ercan Mehmet Dede

IPC: H05K7/20

CPC classification number: F28F3/048 ,  H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

Abstract translation: 喷射冲击热交换器包括入射射流，目标层，第二层，过渡通道和流体出口。 目标层包括从冲击区域径向延伸的冲击区域和多个靶层微通道。 冷却剂流体的射流冲击目标层在冲击区域并流过径向延伸的目标层微通道朝向目标层的周边。 第二层包括多个径向延伸的第二层微通道。 过渡通道位于目标层和第二层之间，以将第二层流体耦合到目标层。 冷却剂流体流过过渡通道和多个径向延伸的第二层微通道。 流体出口流体地连接到第二层。 喷射冲击交换器可以并入具有电力电子设备的功率电子模块中。

公开(公告)号：US08009419B2

公开(公告)日：2011-08-30

申请号：US12902375

申请日：2010-10-12

Applicant: Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

Inventor： Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20345 ,  H05K7/20772 ,  Y10S165/908 ,  H01L2924/00

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

公开(公告)号：US07969734B2

公开(公告)日：2011-06-28

申请号：US11649173

申请日：2007-01-03

Applicant: Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver, Jr.

Inventor： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver, Jr.

IPC: H05K7/20

CPC classification number: F28F3/04 ,  F04B43/04 ,  F04B43/046 ,  F04D29/582 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract translation: 公开了一种用于冷却电子封装的系统。 该系统包括流体泵和微冷却器组件。 该系统利用在电子封装中散布有电子层的一个或多个冷却层。 每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。 冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过 从微冷却器组件到流体泵的流体。 还公开了一种用于冷却电子封装的方法。

公开(公告)号：US20100241278A1

公开(公告)日：2010-09-23

申请号：US12793905

申请日：2010-06-04

Applicant: Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

Inventor： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

IPC: G05D23/19 ,  G06F1/20 ,  G05D7/06

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  Y10S165/908

Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

公开(公告)号：US20090218078A1

公开(公告)日：2009-09-03

申请号：US12038894

申请日：2008-02-28

Applicant: Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

Inventor： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

IPC: F28D15/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  Y10S165/908

Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

Abstract translation: 这里公开了具有多个液冷计算机系统的数据中心。 计算机系统各自包括与冷板相连的处理器，其允许直接液体冷却处理器。 冷板进一步布置成向处理器的不同部分提供适当的冷却流，从而较高的温度区域接收较大的冷却剂流速。 流量被可变地调整以反映不同的活动水平。 通过使离开计算机系统的冷却剂温度最大化，系统可以利用环境空气的自由冷却温度并且消除对冷却器的需要。 还提供了一个与区域供热系统相结合的数据中心，从计算机系统提取的热量用于抵消碳排放，降低数据中心的总体拥有成本。

公开(公告)号：US07369409B2

公开(公告)日：2008-05-06

申请号：US11166919

申请日：2005-06-24

Applicant: Kazuaki Yazawa

Inventor： Kazuaki Yazawa

IPC: H05K7/20 ,  F28F7/00

CPC classification number: H01L23/34 ,  H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a cooling nozzle corresponding to the position. An emission time computing unit computes a coolant emission time and timing for the cooling nozzle. Upon reception of an instruction from the emission control unit, a drive unit drives a nozzle unit, thereby allowing a jet of coolant to impinge upon the electronic device.

Abstract translation: 热分布检测单元检测电子设备的表面上的热分布状态。 排放控制单元根据检测到的热分布状态来识别待冷却的位置。 喷嘴选择单元选择与该位置对应的冷却喷嘴。 排放时间计算单元计算冷却喷嘴的冷却剂排放时间和时间。 在从排放控制单元接收到指令时，驱动单元驱动喷嘴单元，从而允许冷却剂射流撞击电子设备。

公开(公告)号：US20080037221A1

公开(公告)日：2008-02-14

申请号：US11462735

申请日：2006-08-07

Applicant: Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S165/908 ,  H01L2224/0401

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

公开(公告)号：US20070074849A1

公开(公告)日：2007-04-05

申请号：US11242738

申请日：2005-10-04

Applicant: Shrikant Joshi ,  Mohinder Bhatti

Inventor： Shrikant Joshi ,  Mohinder Bhatti

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.

公开(公告)号：US07143815B2

公开(公告)日：2006-12-05

申请号：US11069142

申请日：2005-03-01

Applicant: Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Yong Zhou

Inventor： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port (18), and radiuses of the funnel-shaped channel are descended along a liquid flow direction.

Abstract translation: 液体冷却装置包括具有用于容纳液体的容器（14）的壳体（10）和与容器（14）连通的液体入口（18）。 在液体入口（18）中限定漏斗形通道，并且漏斗形通道的半径沿着液体流动方向下降。

公开(公告)号：US20060266497A1

公开(公告)日：2006-11-30

申请号：US10908758

申请日：2005-05-25

Applicant: Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

Inventor： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10S165/908 ,  H01L2924/00

Abstract: A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

Abstract translation: 一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或 冷却。 歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。 歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。 气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。