公开(公告)号：US10410452B2

公开(公告)日：2019-09-10

申请号：US15962484

申请日：2018-04-25

Applicant: Gentex Corporation

Inventor： Joel A. Stray ,  Dennis E. Vilcans ,  Sinisa Likic ,  Derek S. Blaskowski ,  Thomas S. Wright ,  Jonathan M. Hansen ,  James S. Sheline

IPC: G08B25/00 ,  G07C9/00 ,  G08C19/28 ,  E05F15/77 ,  G08C17/02

Abstract: A circuit assembly comprising a sealed interface is configured to isolate one or more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.

公开(公告)号：US20180336750A1

公开(公告)日：2018-11-22

申请号：US15962484

申请日：2018-04-25

Applicant: Gentex Corporation

Inventor： Joel A. Stray ,  Dennis E. Vilcans ,  Sinisa Likic ,  Derek S. Blaskowski ,  Thomas S. Wright ,  Jonathan M. Hansen ,  James S. Sheline

IPC: G07C9/00 ,  G08C19/28 ,  E05F15/77

CPC classification number: G07C9/00857 ,  E05F15/77 ,  E05Y2800/428 ,  E05Y2900/106 ,  G07C9/00182 ,  G07C9/00944 ,  G07C2009/00968 ,  G08C17/02 ,  G08C19/28 ,  G08C2201/50 ,  G08C2201/62

Abstract: A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.