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公开(公告)号:US10410452B2
公开(公告)日:2019-09-10
申请号:US15962484
申请日:2018-04-25
Applicant: Gentex Corporation
Inventor: Joel A. Stray , Dennis E. Vilcans , Sinisa Likic , Derek S. Blaskowski , Thomas S. Wright , Jonathan M. Hansen , James S. Sheline
Abstract: A circuit assembly comprising a sealed interface is configured to isolate one or more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.
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公开(公告)号:US20180336750A1
公开(公告)日:2018-11-22
申请号:US15962484
申请日:2018-04-25
Applicant: Gentex Corporation
Inventor: Joel A. Stray , Dennis E. Vilcans , Sinisa Likic , Derek S. Blaskowski , Thomas S. Wright , Jonathan M. Hansen , James S. Sheline
CPC classification number: G07C9/00857 , E05F15/77 , E05Y2800/428 , E05Y2900/106 , G07C9/00182 , G07C9/00944 , G07C2009/00968 , G08C17/02 , G08C19/28 , G08C2201/50 , G08C2201/62
Abstract: A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.
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