Abstract:
This invention provides a heat-sealing thermoplastic adhesive of a thermoplastic polymer which is resistant to washing and dry-cleaning, which contains from about 0.05 to about 5% by weight, based on the weight of said polymer, of at least one hydrophobic silicone compound.The invention further provides a process for heat-sealing a substrate which has been at least partly hydrophobized with a silicone compound, which comprises the steps of coating with a heat-sealing thermoplastic adhesive of a thermoplastic polymer which is resistant to washing and dry-cleaning and which contains from about 0.5 to about 5% by weight, based on the weight of said polymer, of at least one hydrophobic silicone compound, sintering, fixing and heat-sealing.The adhesives according to the invention are useful for the bonding of substrates which have been hydrophobically finished with silicone compounds, such as raincoat fabrics.
Abstract:
The invention relates to copolyamides containing caprolactam, lauriclactam, hexamethylene diamine adipate and hexamethylene diamine salt of an aliphatic dicarboxylic acid with a carbon chain of 9, 10, 12 or 13 carbon atoms. The copolyamides are useful as heat-sealing agents.