公开(公告)号：US5210439A

公开(公告)日：1993-05-11

申请号：US728011

申请日：1991-07-05

申请人： Gerhard Conzelmann ,  Ludger Olbrich ,  Gerhard Fiedler

发明人： Gerhard Conzelmann ,  Ludger Olbrich ,  Gerhard Fiedler

IPC分类号： H01L23/52 ,  H01L27/02 ,  H01L29/73

CPC分类号： H01L23/52 ,  H01L27/0211 ,  H01L29/73 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49433 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/14

摘要： A monolithic integrated power transistor chip includes a plurality of transistor cells arranged in two opposite and mutually spaced rows. Each cell has emitter- and collector connection spots arranged side-by-side and connected to corresponding branch conductors directed by rows of connection points extending along opposite edges on the upper surface of the chip.

摘要翻译： 单片集成功率晶体管芯片包括布置在两个相对且相互间隔的行中的多个晶体管单元。 每个单元具有并排布置的发射极和集电极连接点，并且连接到由沿着芯片上表面上的相对边缘延伸的连续点行的相应分支导体。

公开(公告)号：US5345106A

公开(公告)日：1994-09-06

申请号：US11215

申请日：1993-01-29

申请人： Anton Doering ,  Ludger Olbrich

发明人： Anton Doering ,  Ludger Olbrich

IPC分类号： H01L21/48 ,  H01L23/433 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L21/4875 ,  H01L23/4334 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  Y10T29/49121

摘要： A standard lead frame has a carrier pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to the conducting paths on the lead frame the unit is encapsulated in such a fashion that a major surface of the heat sink protrudes from the encapsulation. A standard lead frame may be used as the carrier.

摘要翻译： 标准引线框架具有穿孔的载体以产生足够大的开口，以便在半导体电路芯片的安装中留出空间。 用于半导体电路芯片的散热器被固定在开口中或刚好在开口下方的位置。 然后将半导体电路芯片直接固定到散热器。 在已经接合电线以将芯片的接触区域连接到引线框架上的导电路径之后，该单元被封装成散热器的主表面从封装突出的方式被封装。 可以使用标准引线框作为载体。

公开(公告)号：US5202288A

公开(公告)日：1993-04-13

申请号：US930474

申请日：1992-08-13

申请人： Anton Doering ,  Ludger Olbrich

发明人： Anton Doering ,  Ludger Olbrich

IPC分类号： H01L21/48 ,  H01L23/433

CPC分类号： H01L21/4875 ,  H01L23/4334 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  Y10T29/49121

摘要： A standard lead-frame has an aperture pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to respective parts of the lead frame the unit is encapsulate such a fashion that a major surface of the heat sink protrudes from the encapsulation.

摘要翻译： 标准引线框架具有刺穿的孔径以产生足够大的开口以在其中设置用于半导体电路芯片的安装的空间。 用于半导体电路芯片的散热器被固定在开口中或刚好在开口下方的位置。 然后将半导体电路芯片直接固定到散热器。 在已经接合电线以将芯片的接触区域连接到引线框架的相应部分之后，该单元被封装成散热器的主表面从封装突出的方式。