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公开(公告)号：US10692748B2
公开(公告)日：2020-06-23
申请号：US15828655
申请日：2017-12-01
发明人： Jong Bae Kim , Seung Jin Yang , Jae Suk Heo , Chi Won Choi , Je Min Kim , Hyeung Kwan Kim , Yong Ho Choi
IPC分类号： H01L21/683 , B23Q3/15 , H01L21/67 , H01L21/205 , H01L21/3065 , G01K1/14
摘要： The present invention relates to a high-tech temperature control device for a semiconductor manufacturing facility and, more specifically, to a high-tech temperature control device for an electrostatic chuck, which supports a wafer and maintains the temperature in a semiconductor wafer processing process. It is possible to very precisely control a temperature of an electrostatic chuck by maintaining temperatures and a mixing flow rate of a heating heat medium and a cooling heat medium constant and adjusting a mixing ratio. Meanwhile, the heat medium after heating and cooling is collected and reused, thereby efficiently using energy.
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公开(公告)号：US20180158710A1
公开(公告)日：2018-06-07
申请号：US15828655
申请日：2017-12-01
发明人： Jong Bae Kim , Seung Jin Yang , Jae Suk Heo , Chi Won Choi , Je Min Kim , Hyeung Kwan Kim , Yong Ho Choi
IPC分类号： H01L21/683 , B23Q3/15 , G01K1/14 , H01L21/205 , H01L21/3065 , H01L21/67
CPC分类号： H01L21/6831 , B23Q3/15 , G01K1/14 , H01L21/205 , H01L21/3065 , H01L21/67017 , H01L21/67103 , H01L21/67109 , H01L21/67248
摘要： The present invention relates to a high-tech temperature control device for a semiconductor manufacturing facility and, more specifically, to a high-tech temperature control device for an electrostatic chuck, which supports a wafer and maintains the temperature in a semiconductor wafer processing process. It is possible to very precisely control a temperature of an electrostatic chuck by maintaining temperatures and a mixing flow rate of a heating heat medium and a cooling heat medium constant and adjusting a mixing ratio. Meanwhile, the heat medium after heating and cooling is collected and reused, thereby efficiently using energy.
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