公开(公告)号：US20240371809A1

公开(公告)日：2024-11-07

申请号：US18311712

申请日：2023-05-03

Applicant: GlobalFoundries U.S. Inc.

Inventor： Haritez Narisetty ,  Manubhai Patel Jignesh ,  Ching Theng Lew ,  Ananth Sundaram ,  Muhammed Shafi Kunnathodi ,  Praveen Paul Arotha ,  Varuna AnanthaPadmanabha Baipadi

IPC: H01L23/00 ,  G06F30/39 ,  H01L23/544 ,  H01L25/065

Abstract: Embodiments of the disclosure provide a structure including a passive component traversing multiple semiconductor chips, with related systems and methods. A structure of the disclosure includes a plurality of stacked semiconductor chips including a first chip coupled to a second chip through an interface. A passive component traverses the interface between the first chip and the second chip of the plurality of stacked semiconductor chips. The passive component includes a first portion within the first chip and a second portion within the second chip.