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公开(公告)号:US12191300B2
公开(公告)日:2025-01-07
申请号:US17662921
申请日:2022-05-11
Applicant: GlobalFoundries U.S. Inc.
Inventor: Robert J. Gauthier, Jr. , Rajendran Krishnasamy , Anupam Dutta , Anindya Nath , Xiangxiang Lu , Satyasuresh Vvss Choppalli , Lin Lin
IPC: H01L27/02
Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure with resistive semiconductor material for a back well. The IC structure may include a semiconductor substrate having a deep well, and a device within a first portion of the deep well. The device includes a first doped semiconductor material coupled to a first contact, and a second doped semiconductor material coupled to a second contact. The deep well couples the first doped semiconductor material to the second doped semiconductor material. A first back well is within a second portion of the deep well. A first resistive semiconductor material is within the deep well and defines a boundary between the first portion of the deep well and the second portion of the deep well.
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公开(公告)号:US20230369314A1
公开(公告)日:2023-11-16
申请号:US17662921
申请日:2022-05-11
Applicant: GlobalFoundries U.S. Inc.
Inventor: Robert J. Gauthier, JR. , Rajendran Krishnasamy , Anupam Dutta , Anindya Nath , Xiangxiang Lu , Satyasuresh Vvss Choppalli , Lin Lin
IPC: H01L27/02
CPC classification number: H01L27/0262 , H01L27/0266
Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure with resistive semiconductor material for a back well. The IC structure may include a semiconductor substrate having a deep well, and a device within a first portion of the deep well. The device includes a first doped semiconductor material coupled to a first contact, and a second doped semiconductor material coupled to a second contact. The deep well couples the first doped semiconductor material to the second doped semiconductor material. A first back well is within a second portion of the deep well. A first resistive semiconductor material is within the deep well and defines a boundary between the first portion of the deep well and the second portion of the deep well.
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