公开(公告)号：US09611548B2

公开(公告)日：2017-04-04

申请号：US15076684

申请日：2016-03-22

申请人： GlobalWafers Co., Ltd.

发明人： Yuan-Hao Chang ,  Te-Hao Lee ,  Ying-Ru Shih ,  Wen-Ching Hsu

IPC分类号： C23C18/16 ,  H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC分类号： C23C18/163 ,  H01L21/67057 ,  H01L21/67326 ,  H01L21/68

摘要： A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.

公开(公告)号：US20160322244A1

公开(公告)日：2016-11-03

申请号：US15076684

申请日：2016-03-22

申请人： GlobalWafers Co., Ltd.

发明人： Yuan-Hao Chang ,  Te-Hao Lee ,  Ying-Ru Shih ,  Wen-Ching Hsu

IPC分类号： H01L21/673 ,  C23C18/16 ,  H01L21/67

CPC分类号： C23C18/163 ,  H01L21/67057 ,  H01L21/67326 ,  H01L21/68

摘要： A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.

摘要翻译： 晶片旋转装置包括基座，承载装置，第一轴齿轮，动力单元，滚子，第二轴齿轮和驱动组件。 底座具有容纳空间，承载装置设置在其中以容纳晶片。 第一轴齿轮设置在基座的侧表面上。 动力单元组装到基座的顶部并连接到第一轴齿轮。 辊位于承载装置的下方并支撑晶片的边缘。 第二轴齿轮设置在基座的侧表面上并连接到滚子。 驱动组件连接在第一轴齿轮和第二轴齿轮之间。 功率单元通过第一齿轮，驱动单元和第二轴齿轮提供动力，以驱动辊来旋转晶片。