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公开(公告)号：US20150264837A1
公开(公告)日：2015-09-17
申请号：US14725214
申请日：2015-05-29
Applicant: Google Inc.
Inventor： Jimmy Clidaras , Winnie Leung
IPC: H05K7/20
CPC classification number: H05K7/20754 , H05K7/20745 , H05K7/20836
Abstract: A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.
Abstract translation: 公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度， 当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。
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Patent Agency Ranking
公开(公告)号：US09335797B1
公开(公告)日：2016-05-10
申请号：US14267098
申请日：2014-05-01
Applicant: Google Inc.
Inventor： Jeffrey S. Spaulding , Winnie Leung
CPC classification number: G06F1/185
Abstract: A printed circuit board (PCB) support system includes a guide attachable to a housing of a computing assembly that includes a motherboard and a daughterboard, the guide including a locking assembly that includes a notch and a surface angled toward the notch and is biased to snap over a portion of a side edge of the daughterboard received into the notch; and a PCB support attachable to a surface of the motherboard, the PCB support including a cleft sized to support a bottom edge of the daughterboard.
Abstract translation: 印刷电路板（PCB）支撑系统包括可附接到包括母板和子板的计算组件的壳体的引导件，所述引导件包括锁定组件，所述锁定组件包括凹口和朝向所述凹口成角度并且被偏压以卡扣 在插入凹口中的子板的侧边缘的一部分上; 以及PCB支撑件，其可附接到母板的表面，PCB支撑件包括尺寸设计成支撑子板的底部边缘的裂缝。
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公开(公告)号：US08988879B2
公开(公告)日：2015-03-24
申请号：US13685483
申请日：2012-11-26
Applicant: Google Inc.
Inventor： William Hamburgen , Jimmy Clidaras , Winnie Leung , David W. Stiver , Jonathan D. Beck , Andrew B. Carlson , Steven T. Y. Chow , Gregory P. Imwalle , Amir M. Michael
CPC classification number: G06F1/20 , H05K7/2079 , Y10T29/49826
Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.
Abstract translation: 数据中心冷却装置包括便携式外壳，其具有用于移动设备的提升和传送结构，壳体中的相对侧，至少一个相对侧限定一个或多个空气通道开口，其布置成从机架安装的电子设备捕获温暖的空气， 端部在壳体中，相对的端部中的至少一个限定一个或多个空气通道开口，其定位成允许捕获的空气横向通过壳体和/或从壳体中流出，以及与壳体相关联的一个或多个冷却盘管，以接收和冷却所捕获的 并提供冷却的空气循环进入数据中心工作区。
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4.发明申请公开(公告)号：US20180295751A1
公开(公告)日：2018-10-11
申请号：US15479740
申请日：2017-04-05
Applicant: Google Inc.
Inventor： Jayson Michael Jochim , Angela Chen , Soheil Farshchian , Winnie Leung , Michael Chi Kin Lau
CPC classification number: H05K7/20745 , H05K7/1489 , H05K7/20736 , H05K7/20827 , H05K7/20836
Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
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公开(公告)号：US20160324030A1
公开(公告)日：2016-11-03
申请号：US15211666
申请日：2016-07-15
Applicant: Google Inc.
Inventor： William Leslie Dailey , Winnie Leung , Angela Ying-Ju Chen , Michael John Bliss
IPC: H05K7/14
CPC classification number: H05K7/1489 , G02B6/4452 , G02B6/4471 , H04Q1/09 , H05K7/1417 , H05K7/1488 , H05K7/1492
Abstract: Aspects of the disclosure relate generally to rack systems for housing computing devices. The rack may include shelves supported by flanges of a pair of corresponding inserts. The flanges may be spaced along the length of each of the inserts. The distance between the flanges may define the height of a shelf when placed in the rack. The pair of corresponding inserts may be placed along an inner sidewall of the rack by mating hooks of the inserts with corresponding slots of the inner sidewall and subsequently removed by demating the hooks and slots. For example, a pair of inserts with one distance between the flanges may be replaced by a pair of inserts with another distance between the flanges in order to increase the shelf height of the rack. By replacing the shelves and/or the inserts, a user may quickly and easily in order to reconfigure the rack.
Abstract translation: 本公开的方面通常涉及用于外壳计算设备的机架系统。 机架可以包括由一对相应插入件的凸缘支撑的搁板。 凸缘可以沿着每个插入件的长度间隔开。 凸缘之间的距离可以限定架子放置在机架中时的高度。 一对相应的插入件可以通过将插入件的钩与内侧壁的相应槽配合而沿着齿条的内侧壁放置，随后通过使钩和槽排出来去除。 例如，在凸缘之间具有一个距离的一对插入件可以被一对插入件替代，以在凸缘之间具有另一距离，以便增加机架的搁架高度。 通过更换架子和/或插入件，用户可以快速而容易地重新配置机架。
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公开(公告)号：US10136561B2
公开(公告)日：2018-11-20
申请号：US14725214
申请日：2015-05-29
Applicant: Google Inc.
Inventor： Jimmy Clidaras , Winnie Leung
IPC: H05K7/20
Abstract: A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.
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