Method of fabrication MEMS integrated circuits
    3.
    发明授权
    Method of fabrication MEMS integrated circuits 有权
    MEMS集成电路的制造方法

    公开(公告)号:US07605009B2

    公开(公告)日:2009-10-20

    申请号:US11763444

    申请日:2007-06-15

    IPC分类号: H01L21/00

    摘要: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

    摘要翻译: 一种制造多个MEMS集成电路的方法,该晶片具有在其前侧形成的MEMS层和在所述MEMS层上的聚合物涂层,所述聚合物涂层具有通过其定义的多个前侧切割街道,所述方法包括以下步骤: :(a)将第一保持装置可释放地附接到所述聚合物涂层; 和(b)在所述晶片的背面执行至少一个操作,所述至少一个操作包括通过所述晶片蚀刻多个后侧切割街道,每个后侧切割街道与相应的前方切割街道相交,从而提供所述多个 可释放地附接到所述第一保持装置的MEMS集成电路,其中每个MEMS集成电路包括相应的聚合物涂层。

    METHOD OF FABRICATION MEMS INTEGRATED CIRCUITS
    5.
    发明申请
    METHOD OF FABRICATION MEMS INTEGRATED CIRCUITS 有权
    制造MEMS集成电路的方法

    公开(公告)号:US20080227229A1

    公开(公告)日:2008-09-18

    申请号:US11763444

    申请日:2007-06-15

    IPC分类号: H01L21/00

    摘要: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

    摘要翻译: 一种制造多个MEMS集成电路的方法,该晶片具有在其前侧形成的MEMS层和在所述MEMS层上的聚合物涂层,所述聚合物涂层具有通过其定义的多个前侧切割街道,所述方法包括以下步骤: :(a)将第一保持装置可释放地附接到所述聚合物涂层; 和(b)在所述晶片的背面执行至少一个操作,所述至少一个操作包括通过所述晶片蚀刻多个后侧切割街道,每个后侧切割街道与相应的前方切割街道相交,从而提供所述多个 可释放地附接到所述第一保持装置的MEMS集成电路,其中每个MEMS集成电路包括相应的聚合物涂层。

    METHOD OF FABRICATING PRINTHEAD USING METAL FILM FOR PROTECTING HYDROPHOBIC INK EJECTION FACE
    10.
    发明申请
    METHOD OF FABRICATING PRINTHEAD USING METAL FILM FOR PROTECTING HYDROPHOBIC INK EJECTION FACE 有权
    使用金属膜制作油墨喷墨面的方法

    公开(公告)号:US20080225077A1

    公开(公告)日:2008-09-18

    申请号:US11740925

    申请日:2007-04-27

    IPC分类号: B41J2/16 H05H1/24

    摘要: A method of fabricating a printhead having a hydrophobic ink ejection face, the method comprising the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a nozzle plate having relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face of the printhead; (b) defining a plurality of nozzle openings in the nozzle plate; (c) depositing a hydrophobic polymeric layer onto the nozzle surface; (d) depositing a protective metal film onto the polymeric layer; (e) subjecting the printhead to an oxidizing plasma; and (f) removing the protective metal film, thereby providing a printhead having a relatively hydrophobic ink ejection face. Step (b) may be performed immediately after any of steps (a), (c) or (d).

    摘要翻译: 一种制造具有疏水墨水喷射面的打印头的方法,所述方法包括以下步骤:(a)提供部分制造的打印头,其包括多个喷嘴室和具有相对亲水喷嘴表面的喷嘴板,喷嘴表面至少 部分地限定打印头的喷墨面; (b)在所述喷嘴板中限定多个喷嘴开口; (c)在喷嘴表面上沉积疏水聚合物层; (d)在所述聚合物层上沉积保护性金属膜; (e)使打印头经受氧化等离子体; 和(f)去除保护金属膜,从而提供具有相对疏水的喷墨面的打印头。 步骤(b)可以在步骤(a),(c)或(d)中的任一步骤之后立即进行。