公开(公告)号：US20230197699A1

公开(公告)日：2023-06-22

申请号：US17553995

申请日：2021-12-17

申请人： Ronald L. Spreitzer ,  Ankur Agrawal ,  Guiyun Bai ,  Eleanor Patricia Paras Rabadam ,  Sanjeev Gupta

发明人： Ronald L. Spreitzer ,  Ankur Agrawal ,  Guiyun Bai ,  Eleanor Patricia Paras Rabadam ,  Sanjeev Gupta

IPC分类号： H01L25/16 ,  G01S7/481 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L25/167 ,  G01S7/481 ,  H01L24/17 ,  H01L25/0756 ,  H01L2924/12042

摘要： Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.

公开(公告)号：US20220390562A1

公开(公告)日：2022-12-08

申请号：US17557290

申请日：2021-12-21

申请人： Guiyun Bai ,  Sushrutha Gujjula ,  Ronald L. Spreitzer ,  Naresh Satyan ,  David Mathine ,  Sam Khalili ,  Sanjeev Gupta ,  Eleanor Patricia Paras Rabadam ,  Ankur Agrawal ,  Kenneth Brown ,  Jonathan Doylend ,  Daniel Grodensky ,  Israel Petronius

发明人： Guiyun Bai ,  Sushrutha Gujjula ,  Ronald L. Spreitzer ,  Naresh Satyan ,  David Mathine ,  Sam Khalili ,  Sanjeev Gupta ,  Eleanor Patricia Paras Rabadam ,  Ankur Agrawal ,  Kenneth Brown ,  Jonathan Doylend ,  Daniel Grodensky ,  Israel Petronius

IPC分类号： G01S7/481 ,  B81B7/02 ,  G01S17/931

摘要： Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

公开(公告)号：US07818878B2

公开(公告)日：2010-10-26

申请号：US12042222

申请日：2008-03-04

申请人： Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

发明人： Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

IPC分类号： H05K3/30

CPC分类号： H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/1061 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

摘要翻译： 在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。 描述和要求保护其他实施例。

公开(公告)号：US07302756B2

公开(公告)日：2007-12-04

申请号：US10612281

申请日：2003-06-30

申请人： Brian Taggart ,  Ronald L. Spreitzer ,  Robert Nickerson

发明人： Brian Taggart ,  Ronald L. Spreitzer ,  Robert Nickerson

IPC分类号： H01K3/10

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K2201/096 ,  H05K2203/049 ,  Y02P70/611 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package includes coupling the die to the wire-bond pad. A computing system includes the wire-bonding substrate.

摘要翻译： 引线键合衬底包括第一引线接合焊盘和布线键合衬底中的第一引线接合焊盘正下方的第一通孔。 封装包括耦合到第一引线接合焊盘的裸片。 封装可以包括通过诸如焊球之类的电连接而与引线键合衬底耦合的较大衬底。 形成引线接合基板的工艺包括通孔形成以在引线接合焊盘上停止。 组装微电子封装的方法包括将管芯耦合到引线接合焊盘。 计算系统包括引线接合衬底。

公开(公告)号：US07358444B2

公开(公告)日：2008-04-15

申请号：US10964790

申请日：2004-10-13

申请人： Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

发明人： Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

IPC分类号： H05K1/00

CPC分类号： H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/1061 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

摘要翻译： 在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。 描述和要求保护其他实施例。

公开(公告)号：US07304373B2

公开(公告)日：2007-12-04

申请号：US10977908

申请日：2004-10-28

申请人： Brian Taggart ,  Robert M. Nickerson ,  Ronald L. Spreitzer

发明人： Brian Taggart ,  Robert M. Nickerson ,  Ronald L. Spreitzer

IPC分类号： H01L23/02

CPC分类号： H01L23/50 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.

摘要翻译： 一种装置包括折叠的柔性基底。 存储芯片连接到折叠的柔性基板的第一侧。 逻辑裸片连接到折叠的柔性基板的第二侧。 源电压信号的跟踪路由模式与集电极电压信号的跟踪路由模式相同。