摘要:
Disclosed is a method for the xerographic, pattern-wise deposition of a dielectric powder that is sensitized with a metal compound to enable the electroless plating of a pattern formed by said powder.
摘要:
This invention relates to a powder for use in dry sensitization for electroless plating, the powder comprising a plastics base material which is a mixture of hydrophobic and hydrophilic plastics materials to which has been added sensitizing particles.