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公开(公告)号:US08704338B2
公开(公告)日:2014-04-22
申请号:US13247162
申请日:2011-09-28
申请人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
发明人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
IPC分类号: H01L23/544 , H01L21/78
CPC分类号: H01L21/78 , G06F17/5068 , H01L21/82 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要: A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.
摘要翻译: 芯片包括电介质层中的电介质层和填充结构,其中填充结构沿芯片的切割边缘延伸,填充结构邻接切割边缘。
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公开(公告)号:US20130075869A1
公开(公告)日:2013-03-28
申请号:US13247162
申请日:2011-09-28
申请人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
发明人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
IPC分类号: H01L23/544 , G06F17/50 , H01L21/78
CPC分类号: H01L21/78 , G06F17/5068 , H01L21/82 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要: A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.
摘要翻译: 芯片包括电介质层中的电介质层和填充结构,其中填充结构沿芯片的切割边缘延伸,填充结构邻接切割边缘。
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3.
公开(公告)号:US08809165B2
公开(公告)日:2014-08-19
申请号:US13594946
申请日:2012-08-27
申请人: Gunther Mackh , Gerhard Leschik
发明人: Gunther Mackh , Gerhard Leschik
IPC分类号: H01L21/00
CPC分类号: H01L23/5258 , B23K26/40 , B23K2103/50 , H01L21/268 , H01L23/544 , H01L2223/5444 , H01L2924/0002 , H01L2924/00
摘要: A method for fusing a laser fuse in accordance with various embodiments may include: providing a semiconductor workpiece having a substrate region and at least one laser fuse; fusing the at least one laser fuse from a back side of the substrate region by means of an infrared laser beam.
摘要翻译: 根据各种实施例的用于熔合激光熔丝的方法可以包括:提供具有衬底区域和至少一个激光熔丝的半导体工件; 通过红外激光束将至少一个激光熔丝从衬底区域的背面熔合。
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4.
公开(公告)号:US20140057412A1
公开(公告)日:2014-02-27
申请号:US13594946
申请日:2012-08-27
申请人: Gunther Mackh , Gerhard Leschik
发明人: Gunther Mackh , Gerhard Leschik
IPC分类号: H01L21/268 , H01L21/78
CPC分类号: H01L23/5258 , B23K26/40 , B23K2103/50 , H01L21/268 , H01L23/544 , H01L2223/5444 , H01L2924/0002 , H01L2924/00
摘要: A method for fusing a laser fuse in accordance with various embodiments may include: providing a semiconductor workpiece having a substrate region and at least one laser fuse; fusing the at least one laser fuse from a back side of the substrate region by means of an infrared laser beam.
摘要翻译: 根据各种实施例的用于熔合激光熔丝的方法可以包括:提供具有衬底区域和至少一个激光熔丝的半导体工件; 通过红外激光束将至少一个激光熔丝从衬底区域的背面熔合。
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