公开(公告)号：US20240263308A1

公开(公告)日：2024-08-08

申请号：US18640875

申请日：2024-04-19

Applicant: HANWHA PRECISION MACHINERY CO., LTD.

Inventor： Dong Won SEO ,  Dong Suk KANG ,  Yoo Seong KIM ,  Jeong Sub SHIN ,  Kyu Beom LEE

IPC: C23C16/455 ,  C23C16/44 ,  H01L21/02 ,  H01L21/67

CPC classification number: C23C16/45536 ,  C23C16/4412 ,  C23C16/45557 ,  H01L21/02697 ,  H01L21/67201

Abstract: A substrate treatment apparatus including a process chamber configured to process a wafer therein; a load lock chamber configured to accommodate the wafer and configured to switch between an atmospheric state and a vacuum state; and a load lock radical supply configured to supply radicals into the load lock chamber. The substrate treatment apparatus further including: a front opening unified pod (FOUP) configured to accommodate the wafer; an equipment front end module (EFEM) provided between the FOUP and the load lock chamber, the EFEM configured to transfer the wafer to the load lock chamber in the atmospheric state; and a transfer chamber provided between the process chamber and the load lock chamber, the transfer chamber configured to transfer the wafer to the process chamber in the vacuum state