公开(公告)号：US20210309880A1

公开(公告)日：2021-10-07

申请号：US17352434

申请日：2021-06-21

申请人： Henkel AG & Co. KGaA

发明人： Thomas S. Smith, II ,  John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Lisa K. Miller ,  William G. Kozak ,  Eric C. Kuhns

IPC分类号： C09D133/14 ,  C08F120/20 ,  H05K3/28

摘要： Disclosed is a process that utilizes a modified Atom Transfer Radical Polymerization (ATRP) process to form a water-resistant coating in situ on a substrate. The process uses solvent soluble monomers, initiator and ligand to form a solvent insoluble water-resistant polymer coating that is deposited directly onto a metal trace on the substrate. The process is especially useful for providing a water-resistant coating to the circuits on a printed circuit board, wearable electronics, and biological sensors. The process can be run in an aqueous solvent in the open atmosphere and does not require a vacuum, heating steps or masking. The coating is deposited only on the metal trace and closely adjacent areas of the substrate.

公开(公告)号：US12110413B2

公开(公告)日：2024-10-08

申请号：US17448404

申请日：2021-09-22

申请人： Henkel AG & Co. KGaA

发明人： John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Thomas S. Smith, II ,  William G. Kozak ,  Lisa K. Miller ,  Eric C. Kuhns

IPC分类号： C09D7/65 ,  C09D4/06 ,  C09D5/00 ,  C09D7/20 ,  C09D109/02 ,  C09D135/02 ,  C09D153/00 ,  H05K3/28

CPC分类号： C09D5/00 ,  C09D4/06 ,  C09D7/20 ,  C09D7/65 ,  C09D109/02 ,  C09D135/02 ,  C09D153/00 ,  H05K3/282 ,  H05K3/284

摘要： A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.

公开(公告)号：US20220002559A1

公开(公告)日：2022-01-06

申请号：US17448404

申请日：2021-09-22

申请人： Henkel AG & Co. KGaA

发明人： John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Thomas S. Smith, II ,  William G. Kozak ,  Lisa K. Miller ,  Eric C. Kuhns

IPC分类号： C09D5/00 ,  C09D153/00 ,  C09D135/02 ,  C09D109/02 ,  C09D4/06 ,  C09D7/20 ,  C09D7/65 ,  H05K3/28

摘要： A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.

公开(公告)号：US11072712B2

公开(公告)日：2021-07-27

申请号：US13705576

申请日：2012-12-05

申请人： HENKEL AG & CO. KGaA

发明人： Kirk Kramer ,  Lisa K. Miller ,  Shawn E. Dolan ,  Patrick A. Scalera

IPC分类号： C09D5/08 ,  B32B33/00 ,  B32B15/04 ,  C23C18/12 ,  C23C22/56 ,  C09D1/00 ,  C23C22/83

摘要： A coating composition and a method is used to coat metallic substrates for corrosion resistance. The coating composition includes acid, metal acetate, organosilane and water. The method includes steps of depositing the composition on an aluminum or aluminum alloy substrate and allowing the composition to dry to form a sol-gel coating on the substrate.