公开(公告)号：US08835574B2

公开(公告)日：2014-09-16

申请号：US13680522

申请日：2012-11-19

Applicant: Henkel Corporation

Inventor： My Nguyen ,  Tadashi Takano ,  Puwei Liu

IPC: C08L63/00 ,  C08L63/02 ,  C08L63/06 ,  B32B27/38 ,  C09J163/00 ,  C09J163/02 ,  C09J163/06 ,  C09J133/04 ,  C08L33/02 ,  C08L33/06

CPC classification number: C09J163/00 ,  C08L33/02 ,  C08L33/068 ,  C08L53/00 ,  C08L63/00 ,  C08L2666/02 ,  C09J7/20 ,  C09J133/04 ,  C09J153/00 ,  C09J163/06 ,  C09J2203/326 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/32145 ,  H01L2224/83191 ,  Y10T428/287 ,  Y10T428/31511

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract translation: 可用于模具附着工艺的新型粘合剂组合物。 粘合剂包括可固化树脂组分，固化剂和嵌段共聚物添加剂。 嵌段共聚物添加剂具有至少约40℃的玻璃化转变温度。在芯片拾取过程中，嵌段共聚物添加剂改善了粘合剂组合物对亲水基材（例如硅晶片）的亲和性。 还公开了一种组件，其包括亲水基底和粘合剂层以及制造组件的方法。

公开(公告)号：US20140264165A1

公开(公告)日：2014-09-18

申请号：US13840248

申请日：2013-03-15

Applicant: HENKEL CORPORATION

Inventor： Puwei Liu ,  Donghang Xie ,  Emilie Barriau ,  Shengqian Kong

IPC: C09D167/00 ,  C09J167/00

CPC classification number: C09D167/00 ,  C07D201/00 ,  C07D305/06 ,  C07D307/89 ,  C07D407/12 ,  C07D493/04 ,  C08G59/20 ,  C08G63/42 ,  C09J167/00

Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.

Abstract translation: 提供含有氧杂环丁烷的化合物，以及含有氧杂环丁烷的化合物与羧酸，潜在羧酸和/或具有羧酸和潜在羧酸官能团的化合物的组合物。 含氧杂环丁烷的化合物及其组合物可用作LED装置的粘合剂，密封剂和密封剂，特别是用于组件，以及组装中。

公开(公告)号：US20130079475A1

公开(公告)日：2013-03-28

申请号：US13680522

申请日：2012-11-19

Applicant: Henkel Corporation

Inventor： My Nguyen ,  Tadashi Takano ,  Puwei Liu

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08L33/02 ,  C08L33/068 ,  C08L53/00 ,  C08L63/00 ,  C08L2666/02 ,  C09J7/20 ,  C09J133/04 ,  C09J153/00 ,  C09J163/06 ,  C09J2203/326 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/32145 ,  H01L2224/83191 ,  Y10T428/287 ,  Y10T428/31511

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract translation: 可用于模具附着工艺的新型粘合剂组合物。 粘合剂包括可固化树脂组分，固化剂和嵌段共聚物添加剂。 嵌段共聚物添加剂具有至少约40℃的玻璃化转变温度。在芯片拾取过程中，嵌段共聚物添加剂改善了粘合剂组合物对亲水基材（例如硅晶片）的亲和性。 还公开了一种组件，其包括亲水基底和粘合剂层以及制造组件的方法。