公开(公告)号：US20200245503A1

公开(公告)日：2020-07-30

申请号：US16258887

申请日：2019-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David Chialastri ,  Travis J. Gaskill ,  Vincent W. Michna ,  Nilashis Dey ,  Patrick Raymond

IPC: H05K7/20 ,  F25D23/12

Abstract: A method for balancing air flow impedance within an enclosure. The method includes determining a configuration of each hardware module of a plurality of hardware modules arranged in a housing of the enclosure. The method also includes determining impedance settings for a plurality of adjustable air flow impedance elements within the housing, based at least in part on the configurations of the plurality of hardware modules, that will balance air flow impedances of the plurality of hardware modules. The method further includes setting the plurality of adjustable air flow impedance elements according to the determined impedance settings.

公开(公告)号：US20200100380A1

公开(公告)日：2020-03-26

申请号：US16139261

申请日：2018-09-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Vincent W. Michna ,  Nilashis Dey ,  Charles Cornwell ,  David Chialastri

IPC: H05K7/14 ,  H01H13/86 ,  G06F3/02

Abstract: Examples described herein include a backplane keying mechanism. The backplane keying mechanism may include a backplane, a first connector, a second connector, a first block for the first connector, and a second block for the second connector. The first block and the second block may be moveable as one unit on the backplane from a first state to a second state. In the first state, the first block allows the first connect to connect to a first type of device and the second block allows the second connector to connect to the first type of device. In the second state, the first block prohibits the first connector from connecting to the first type of device and the second block prohibits the second connector from connecting to the first type of device.