公开(公告)号：US20170227247A1

公开(公告)日：2017-08-10

申请号：US15329546

申请日：2014-08-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： James Anthony OLIVER ,  James Jeffery SCHULZE ,  Davis Matthew CASTILLO

IPC: F24F11/00 ,  F24F11/053 ,  G06F1/20 ,  G05B15/02

CPC classification number: F24F11/77 ,  F24F11/76 ,  G05B15/02 ,  G06F1/20 ,  G06F1/206

Abstract: Example implementations relate to a thermal management door assembly. One example apparatus includes a first fan assembly including an intake region and an exhaust region. The apparatus also includes a second fan assembly aligned with the first fan assembly. The apparatus further includes a thermal management door assembly positioned between the first fan assembly and the second fan assembly. The thermal management door assembly includes a frame coupled to the first fan assembly and to the second fan assembly. The thermal management door assembly also includes a sealing door movably coupled to the frame to control an amount of air recirculation from the exhaust region to the intake region.