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公开(公告)号:US20190179721A1
公开(公告)日:2019-06-13
申请号:US16066144
申请日:2016-01-26
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Mark Vinod Kapoor , Martin McAlee , Hermann Wienchoi
Abstract: Methods and apparatus to store fault data and/or status data associated with an integrated circuit (100) into a memristor system (106) are disclosed. An example method includes determining when a fault corresponding to an integrated circuit (100) has occurred, when first data related to the integrated circuit (100) is updated. An example method further includes storing the first data in a first subset of a plurality of resistive elements. An example method further includes, in response to the detection of the fault, storing second data in a second subset of the plurality of resistive elements, the second data corresponding to an error associated with the fault.
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公开(公告)号:US10524378B2
公开(公告)日:2019-12-31
申请号:US15773163
申请日:2015-12-08
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Mark Vinod Kapoor , John Norton , Owen Oliver Kidd
Abstract: Examples herein disclose an apparatus for securing or disengaging a blade server in an enclosure. The apparatus includes a worm gear and a cam gear. The worm gear includes a number of threads to interact with a number of teeth on the cam gear. The cam gear includes the number of teeth to interact with the number of threads and a latch. The latch rotates based on the number of threads interacting with the number of teeth such that the rotation secures or disengages the blade server from the enclosure.
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公开(公告)号:US09860975B2
公开(公告)日:2018-01-02
申请号:US15109177
申请日:2014-01-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Mark Vinod Kapoor , David W. Engler
CPC classification number: H05K1/0271 , H05K1/0209 , H05K1/0228 , H05K1/0243 , H05K1/116 , H05K2201/10159 , H05K2201/10189
Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.
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公开(公告)号:US20180332729A1
公开(公告)日:2018-11-15
申请号:US15773163
申请日:2015-12-08
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Mark Vinod Kapoor , John Norton , Owen Oliver Kidd
IPC: H05K7/14
CPC classification number: H05K7/1489
Abstract: Examples herein disclose an apparatus for securing or disengaging a blade server in an enclosure. The apparatus includes a worm gear and a cam gear. The worm gear includes a number of threads to interact with a number of teeth on the cam gear. The cam gear includes the number of teeth to interact with the number of threads and a latch. The latch rotates based on the number of threads interacting with the number of teeth such that the rotation secures or disengages the blade server from the enclosure.
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公开(公告)号:US20160330832A1
公开(公告)日:2016-11-10
申请号:US15109177
申请日:2014-01-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Mark Vinod Kapoor , David W. Engler
CPC classification number: H05K1/0271 , H05K1/0209 , H05K1/0228 , H05K1/0243 , H05K1/116 , H05K2201/10159 , H05K2201/10189
Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.
Abstract translation: 一种印刷电路板(PCB),其具有围绕至少一个通孔的热释放垫。 热释放垫包括至少四个热切口和至少四个导电带。 至少四个导电带形成在至少四个热切口之间,使得相邻的导电焊盘彼此正交。 每对相互相对的导电带具有基本上相等的长度,并且每对相邻的导电带具有不相等的长度。
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