公开(公告)号：US20200301486A1

公开(公告)日：2020-09-24

申请号：US16649178

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： BAOSHENG ZHANG ,  DEREK KANAS ,  CHAN PARK ,  ANDREW ELSEY

IPC: G06F1/20 ,  G06F1/16 ,  H05K5/02

Abstract: Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.

公开(公告)号：US20210013464A1

公开(公告)日：2021-01-14

申请号：US16962664

申请日：2018-03-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： ALEXANDER WAYNE CLARK ,  ANDREW ELSEY ,  CHAN-WOO PARK

IPC: H01M2/10 ,  H04M1/02

Abstract: An example battery replacement device includes a body, and an alignment guide coupled to the body to fit around a portion of an electrical device to guide the battery replacement device in alignment with the electrical device. The battery replacement device also includes a battery coupling device formed at a first portion of the body to couple to a used battery of the electrical device, and a recess defined in a second portion of the body to retain a replacement battery.