公开(公告)号：US20220065264A1

公开(公告)日：2022-03-03

申请号：US17011010

申请日：2020-09-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Shih-Han Chen ,  Hung-Wen Chang ,  Ai-Tsung Li

IPC: F04D29/42

Abstract: Examples herein relate to fan bodies with pressure regulating chambers. For instance, in some examples a fan body can define an outlet, an inlet, a fan chamber that is in fluidic communication with the inlet and the outlet, and a hollow pressure regulating chamber having an opening that is in fluidic communication with the fan chamber.

公开(公告)号：US11914436B2

公开(公告)日：2024-02-27

申请号：US17419801

申请日：2019-09-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hung-Wen Chang ,  Ai-Tsung Li ,  Shih-Han Chen

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G05B2219/49216

Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

公开(公告)号：US11259423B2

公开(公告)日：2022-02-22

申请号：US16074175

申请日：2016-10-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Kevin Voss ,  Ai-Tsung Li ,  Wei Kuang Chu ,  Wei-Chung Chen

IPC: B32B3/00 ,  H05K5/02 ,  B32B3/26 ,  B32B7/14 ,  G06F1/16 ,  H05K5/00

Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

公开(公告)号：US20220221917A1

公开(公告)日：2022-07-14

申请号：US17615344

申请日：2019-09-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hung-Wen Chang ,  Ai-Tsung Li ,  Hao-Wu Yang ,  Chien-Tu Cheng ,  Shih-Han Chen

IPC: G06F1/20 ,  H05K7/20

Abstract: Examples of a chassis component are described herein. In an example, the chassis component can have a recess having a mesh structure and a working fluid disposed therein. A conductive cover can seal the recess with the mesh structure and the working fluid therein.

公开(公告)号：US20220187882A1

公开(公告)日：2022-06-16

申请号：US17419801

申请日：2019-09-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hung-Wen Chang ,  Ai-Tsung Li ,  Shih-Han Chen

IPC: G06F1/20

Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

公开(公告)号：US20220386506A1

公开(公告)日：2022-12-01

申请号：US17775908

申请日：2019-11-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hao-Wu Yang ,  Ai-Tsung Li ,  Hung-Wen Chang ,  Chien-Tu Cheng

IPC: H05K7/20 ,  G06F1/20

Abstract: Example implementations relate to heat-sink chambers. For instance, in an example a heat-sink can include a body including a first surface and a second surface, where the body defines: a chamber that extends from the first surface through a portion of a total thickness of the body; an opening in the second surface; and a channel that extends from the chamber through a remaining portion of the total thickness of the body to the opening to couple the chamber to the opening.

公开(公告)号：US11306731B2

公开(公告)日：2022-04-19

申请号：US17011010

申请日：2020-09-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Shih-Han Chen ,  Hung-Wen Chang ,  Ai-Tsung Li

IPC: F04D29/42

Abstract: Examples herein relate to fan bodies with pressure regulating chambers. For instance, in some examples a fan body can define an outlet, an inlet, a fan chamber that is in fluidic communication with the inlet and the outlet, and a hollow pressure regulating chamber having an opening that is in fluidic communication with the fan chamber.

公开(公告)号：US11293457B2

公开(公告)日：2022-04-05

申请号：US16755803

申请日：2018-01-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ai-Tsung Li ,  Chao-Wen Cheng

IPC: F04D29/66 ,  G01H1/00 ,  G06F1/20 ,  H05K7/20

Abstract: In example implementations, an apparatus is provided. The apparatus includes an accelerometer, a plurality of fan blades, a coil magnet and a processor. The accelerometer is coupled to a motor to measure an amount of vibration. The plurality of fan blades is coupled to the motor. Each one of the plurality of fan blades comprises a magnet. The coil magnet is coupled to a fan housing that encloses the motor, the plurality of fan blades and the accelerometer. The processor is communicatively coupled to the motor, the accelerometer, and the coil magnet. The processor activates the coil magnet to control a balance of the plurality of fan blades in response to an amount of vibration measured by the accelerometer that exceeds a threshold.