公开(公告)号：US20240292924A1

公开(公告)日：2024-09-05

申请号：US18575839

申请日：2021-07-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lluis HIERRO DOMENECH ,  Davinia FONT CALAFELL ,  Cristina DOMINGUEZ MANCHADO ,  Jordi CASELLAS LOPEZ ,  Bernat POLL CRESPO

IPC: A43B7/1455 ,  G06F30/00 ,  G06F111/16

CPC classification number: A43B7/147 ,  G06F30/00 ,  G06F2111/16

Abstract: In an example, a foot support is described. The foot support comprises a support portion, an extension portion extending from the support portion, and at least one closable opening formed in the foot support. The extension portion is integral with the support portion. Upon flexing of the foot support by application of a bending force between the support portion and the extension portion, closure of the at least one opening is to prevent further flexing of the foot support beyond a specified angle range.

公开(公告)号：US20220346504A1

公开(公告)日：2022-11-03

申请号：US17244071

申请日：2021-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Alberto Maria CANALS POU ,  Davinia FONT CALAFELL

IPC: A43D1/02 ,  A43B13/00 ,  B33Y50/00 ,  B33Y80/00

Abstract: A computer-implemented method is disclosed. The computer-implemented method comprises receiving biometric data relating to a foot of a subject. The computer-implemented method also comprises determining, based on the biometric data, properties of an outsole of an article of footwear to be manufactured for the subject. The computer-implemented method also comprises providing data defining the properties of the outsole for delivery to an additive manufacturing apparatus. An apparatus and a machine-readable medium are also disclosed.

公开(公告)号：US20250009072A1

公开(公告)日：2025-01-09

申请号：US18704891

申请日：2021-10-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Davinia FONT CALAFELL ,  Bernat POLL CRESPO ,  Cristina DOMINGUEZ MANCHADO ,  Lluis HIERRO DOMENECH ,  Jordi CASELLAS LOPEZ

IPC: A43B17/00 ,  G06F30/17 ,  G06F113/10

Abstract: A modular insole for an article of footwear is disclosed. The modular insole comprises a shell portion having a first surface arranged to face a foot of a wearer of the article of footwear and a second surface arranged to face away from the foot of the wearer; and a stiffening element capable of being removably coupled to the second surface of the shell portion and arranged to modify a stiffness of the modular insole when the stiffening element is coupled to the shell portion. A method and a machine-readable medium are also disclosed.

公开(公告)号：US20240418236A1

公开(公告)日：2024-12-19

申请号：US18704887

申请日：2021-10-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lluis HIERRO DOMENECH ,  Cristina DOMINGUEZ MANCHADO ,  Bernat POLL CRESPO ,  Davinia FONT CALAFELL ,  Jordi CASELLAS LOPEZ ,  Jordi ARCAS MANRIQUE

IPC: F16F15/067 ,  B29C64/386 ,  B33Y80/00 ,  F16F3/04

Abstract: In an example, a flexible structure comprises a plurality of interlinked spring units. Each spring unit may comprise at least three coaxial coiled springs, and each spring of a spring unit may comprise a first end and second end. In some examples, an end of one spring adjoins an end of a spring of an adjacent spring unit.

公开(公告)号：US20230356457A1

公开(公告)日：2023-11-09

申请号：US18028529

申请日：2020-10-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Davinia FONT CALAFELL ,  Alberto Maria CANALS POU ,  Adam FRANKS

IPC: B29C64/124 ,  B29C64/393 ,  B33Y80/00 ,  B33Y50/02

CPC classification number: B29C64/124 ,  B29C64/393 ,  B33Y80/00 ,  B33Y50/02

Abstract: An object of which at least a part has been 3D printed is disclosed herein. The part comprising a plurality of layers of a predetermined thickness including an outer layer and an underlying layer immediately below the outer layer. The outer layer comprises a first set of solidified portions and a first set of voids arranged in a 3D pattern such that the first set of solidified portions are raised above the underlying layer to form a first functional structure. The underlying layer comprises a second set of solidified portions and a second set of voids arranged in a 3D pattern such that the second set of solidified portions are raised above its underlying layer, to form a second functional structure, wherein the voids are encapsulated within the object; such that removal of a portion of the outer layer exposes a corresponding portion of the second functional structure.

公开(公告)号：US20230147553A1

公开(公告)日：2023-05-11

申请号：US17794933

申请日：2020-04-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Esteve COMAS CESPEDES ,  Michel Georges ENCRENAZ ,  Sergi CULUBRET CORTADA ,  Davinia FONT CALAFELL ,  Luis GARCIA GARCIA

IPC: B22F12/70 ,  B22F10/16 ,  B22F10/322 ,  B22F12/13 ,  B22F12/20 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/165 ,  B29C64/393 ,  B29C64/295 ,  B29C64/364

CPC classification number: B22F12/70 ,  B22F10/16 ,  B22F10/322 ,  B22F12/13 ,  B22F12/20 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/165 ,  B29C64/393 ,  B29C64/295 ,  B29C64/364

Abstract: According to one example, there is provided an apparatus to process volume of particulate build material. The apparatus comprises a sealable chamber to house a volume of particulate build material, a gas supply to supply the chamber with a predetermined gas, a gas circulator to circulate the gas within the volume of build material, a temperature controller to heat the circulated gas to a predetermined heating temperature to heat the volume of build material to the heating temperature and then to cool the circulated gas to a predetermined cooling temperature to cool the volume of build material to the cooling temperature.